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Journal of Engineering Materials and Technology, 2007
Abstract This paper investigated the scribing process characteristics of the hard and brittle materials including single crystal silicon, STV glass, and sapphire substrate. Under various cutting angles, major process characteristics are examined including the groove geometry, specific cutting energy, and critical depth of cut at the ...
Jiunn-Jyh Junz Wang, Yong-Yuan Liao
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Abstract This paper investigated the scribing process characteristics of the hard and brittle materials including single crystal silicon, STV glass, and sapphire substrate. Under various cutting angles, major process characteristics are examined including the groove geometry, specific cutting energy, and critical depth of cut at the ...
Jiunn-Jyh Junz Wang, Yong-Yuan Liao
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Specific cutting energy: a physical measurement for representing tool wear
The International Journal of Advanced Manufacturing Technology, 2019In a machining context, unexpected tool breakage is still one of the primary causes of increase costs and machine downtimes. Hence, to increase productivity and ensure a company’s financial survival, a way to monitor cutting tool is essential. Thus, this paper proposes to show that it is possible to predict tool wear, with a low error, by using a ...
Antoine Proteau +2 more
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The International Journal of Advanced Manufacturing Technology, 2023
Shijin Lu +3 more
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Shijin Lu +3 more
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Cutting energy characteristics for brittleness evaluation of rock using digital drilling method
Engineering Geology, 2023Haoteng Wang
exaly
SPECIFIC CUTTING ENERGY IN THE FULL-FACE TUNNELING
SGEM International Multidisciplinary Scientific GeoConference EXPO Proceedings, 2012openaire +1 more source