Results 291 to 300 of about 797,630 (345)

A simulation-based optimization approach to design optimal layouts for block stacking warehouses

International Journal of Production Economics, 2020
Abstract Storing pallets of products on top of one another on the floor of a warehouse is called block stacking. The arrangement of lanes, aisles, and cross-aisles in this storage system affects both utilization of the storage space and material handling costs; however, the existing literature focuses exclusively on lane depths and their impact on ...
Kevin R. Gue, Jeffrey S. Smith, Shahab Derhami   +2 more
openaire   +2 more sources

Mathematical model for planning the layout and stacking of granite blocks in a maritime terminal

International Journal of Logistics Systems and Management, 2017
The break-bulk trade has a significant role in international maritime trade. Brazil exports several break-bulk cargoes, especially granite blocks. The port administration should plan the yard operations, putting more granite blocks in the same area and also reducing the distance travelled by the trucks from the storage yard to the seaside.
Bianca Passos Arpini, Dahlen Siqueira Silva, Eliane Gerzelj, Rodrigo de Alvarenga Rosa, Andrea Guenzani, Karina Pedrini Fraga   +5 more
openaire   +2 more sources

Thermal Layout Optimization of Stacked Chip Based on Ant Colony Algorithm

Advanced Materials Research, 2012
In this paper, an ant colony algorithm based on mutual information similarity is proposed to solve the stacked chips on the thermal layout optimization. In order to express the mutual information entropy between the optimal path and walking path, a new similarity impact factor is added in the algorithm operators of ant colony algorithm which increases ...
Qian Su, Wen Dan Xu, Jiang Guo Jiang, Ling Feng Shi   +3 more
openaire   +2 more sources

3D Perception Framework for Stacked Container Layout in the Physical Internet

2018
The Physical Internet concept was developed to address the current unsustainability problem of logistic systems. The key elements are the encapsulation and the handling of world-standard smart green modular containers (π-containers) throughout an open global logistic infrastructure.
Hoa Tran-Dang, Dong-Seong Kim
openaire   +2 more sources

Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging

Arabian Journal for Science and Engineering, 2017
This study investigates fluid–structure interaction (FSI) analysis of stacked chip in the encapsulation of molded underfill packaging using ANSYS Coupling Work bench with fluid and structural solvers. During encapsulation, FSI analysis is applied to a molded package with different layouts, namely cases 1–4 of stacked chip.
R. C. Ooi, M. S. Abdul Aziz, W. K. Loh, M. H. H. Ishak, C. K. Ooi, A.A. Saad, Muhammad Khalil Abdullah, Mohd Zulkifly Abdullah   +7 more
openaire   +2 more sources

The MeerKAT Graphical User Interface Technology Stack

, 2015
The South African MeerKAT radio telescope, currently being built some 90 km outside the small Northern Cape town of Carnarvon, is a precursor to the Square Kilometre Array (SKA) telescope and will be integrated into the mid-frequency component of SKA ...
M. Alberts, F. Joubert
semanticscholar   +1 more source

Scalable modeling of layout parameters in CMOS integrated stacked millimeter wave transformer

2014 IEEE International Wireless Symposium (IWS 2014), 2014
The scalable modeling of CMOS integrated stacked millimeter wave transformer is presented. The model parameters are only related to the layout and process data. So this model is scalable with the two factors. We provide simple and accurate expressions for the self-inductance, mutual coupling inductance, oxide capacitance and the mutual coupling ...
Wenjuan Zhang, Guiqiang Zhu, Liguo Sun, Fujiang Lin   +3 more
openaire   +2 more sources

Layout Based Full Chip Thermal Simulations of Stacked 3D Integrated Circuits

Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 2003
This paper presents full-chip scale detailed thermal simulations of three-dimensional (3D) integrated circuit (IC) stacks. The inter-layer dielectric (ILD) and inter-metal dielectric (IMD) materials inside 3D IC stacks may cause extensive localized heating. The influence of multiple layers of dielectrics on heat trapping inside the 3D stack is analyzed.
Ashok Raman, Marek Turowski, Monte Mar
openaire   +2 more sources

Optimal Stack Layout Configurations at Automated Container Terminals Using Queuing Network Models

, 2020
D. Roy, R. Koster
semanticscholar   +1 more source

Model-Based Function Call Code Generation and Stack Management in Retargetable Compilers: Application Binary Interface Modeling of Stack Layout and Function Call Sequence

Computer Science in Cars Symposium, 2015
Bogdan Ditu
semanticscholar   +1 more source