Results 31 to 40 of about 7,510 (291)

Thermal Layout Analysis and Design of Direct Methanol Fuel Cells on PCB Based on Novel Particle Swarm Optimization

open access: yesMicromachines, 2019
As a new energy technology, the fuel cell has developed rapidly, and its performance has been continuously improved. Fuel cell stacks composed of multiple single cells are gradually being used in portable electronic products.
Zhenyu Yuan   +4 more
doaj   +1 more source

The Study of Different Fairings for Fairing and Drag Reduction on theLow-wing Layout Aircraft

open access: yesHangkong gongcheng jinzhan, 2018
For the low-wing configuration aircraft, server flow interference exist at the wing-body junction, the boundary layer stack at the junction is the main reason for flow separation, the flow separation results in drag addition.
Zhang Li, Gao Zhenghong
doaj   +1 more source

Towards Defect Phase Diagrams: From Research Data Management to Automated Workflows

open access: yesAdvanced Engineering Materials, EarlyView.
A research data management infrastructure is presented for the systematic integration of heterogeneous experimental and simulation data required for defect phase diagrams. The approach combines openBIS with a companion application for large‐object storage, automated metadata extraction, provenance tracking and federated data access, thereby supporting ...
Khalil Rejiba   +5 more
wiley   +1 more source

Demonstrating more than 2π phase modulation in non-Hermitian asymmetric multilayers

open access: yesNew Journal of Physics, 2023
Phase modulation has come to be recognized as a fundamental paradigm for optical device design in applications involving the spatiotemporal control of optical wavefronts.
Giuseppina Simone
doaj   +1 more source

Additive Manufacturing of Continuous Fibre Reinforced Composites: Process, Characterisation, Modelling, and Sustainability

open access: yesAdvanced Engineering Materials, EarlyView.
Additive manufacturing provides precise control over the placement of continuous fibres within polymer matrices, enabling customised mechanical performance in composite components. This article explores processing strategies, mechanical testing, and modelling approaches for additive manufactured continuous fibre‐reinforced composites.
Cherian Thomas, Amir Hosein Sakhaei
wiley   +1 more source

Ka-Band Three-Stack CMOS Power Amplifier with Split Layout of External Gate Capacitor for 5G Applications

open access: yes, 2023
In this study, we designed a Ka-band two-stage differential power amplifier (PA) using a 65 nm RFCMOS process. To enhance the output power of the PA, a three-stack structure was utilized in the power stage, while the driver stage of the PA was designed ...
Hayeon Jeong   +4 more
core   +1 more source

A Lightweight Procedural Layer for Hybrid Experimental–Computational Workflows in Materials Science

open access: yesAdvanced Engineering Materials, EarlyView.
We unveil a prototype hybrid‐workflow framework that fuses automatedcomputation with hands‐on experiments. Built atop pyiron, a lightweight, parameterized layer translates procedure descriptions into executable manual steps, syncing instrument settings, human interventions, and data capture in real‐time today.
Steffen Brinckmann   +8 more
wiley   +1 more source

A Scalable, Correct Time-stamped Stack [PDF]

open access: yes, 2014
Concurrent data-structures, such as stacks, queues, and deques, often implicitly enforce a total order over elements in their underlying memory layout. However, much of this order is unnecessary: linearizability only requires that elements are ordered if
Andreas Haas   +5 more
core   +1 more source

PASTA‐ELN: Simplifying Research Data Management for Experimental Materials Science

open access: yesAdvanced Engineering Materials, EarlyView.
Research data management faces ongoing hurdles as many ELNs remain complex and restrictive. PASTA‐ELN offers an open‐source, cross‐platform solution that prioritizes simplicity, offline access, and user control. Its in tuitive folder structure, modular Python add‐ons, and open formats enable seamless documentation, FAIR data practices, and easy ...
S. Brinckmann, G. Winkens, R. Schwaiger
wiley   +1 more source

Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout [PDF]

open access: yesIEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2009
The technology of through-silicon vias (TSVs) enables fine-grained integration of multiple dies into a single 3-D stack. TSVs occupy significant silicon area due to their sheer size, which has a great effect on the quality of 3-D integrated chips (ICs).
Dae Hyun Kim 0004   +2 more
openaire   +1 more source

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