Results 211 to 220 of about 186,103 (266)

Electrophoresis-By-Accident in Electrospray Ion Source. [PDF]

Anal Chem
Shaba C, Urban PL.
europepmc   +1 more source

Tissue‐Adhesive Fabric‐Based Bioelectronics for Wearable and Implantable Applications

Advanced Functional Materials, EarlyView.
An implantable and wearable bioelectronic textile (iTextile) is introduced as a unified platform bridging wearable and implantable systems. By integrating a self‐healing polymer, stretchable silk fabric, conductive composite electrodes, and an adhesive hydrogel, the platform enables conformal, stable interfacing with soft tissues. The iTextile supports
Soojung An, Yewon Kim, Kyoungryong Kim, Heewon Choi, Sungjun Yoon, Jaewon Ju, Mikyung Shin, Donghee Son   +7 more
wiley   +1 more source

First-Principles Investigation of Interfacial Bonding, Stability, and Electronic Properties at the Fe(111)/Ti₃SiC₂(0001) Interface. [PDF]

Nanomaterials (Basel)
Wang X, Li W, Peng Z, Yang X, Wang M.
europepmc   +1 more source

Machine learning-based prediction of soiling losses in photovoltaic modules under different cleaning frequencies: an experimental investigation. [PDF]

Sci Rep
Shukla A, Pachauri RK, Walia R, Gupta V.
europepmc   +1 more source

Glass bead games: enumeration of possible polytypes based on two stacking vectors and applications to the iron-ore sinter phases SFCA and SFCA-I. [PDF]

Acta Crystallogr A Found Adv
Salzmann MF, Kahlenberg V, Krüger H, Netzer T.   +3 more
europepmc   +1 more source

Calculation of Austenite Generalized Stacking Fault Energy in M50NiL Steel. [PDF]

Materials (Basel)
Ding Z, Guo J, Zhou L, Zhang X, Ma X.
europepmc   +1 more source

π-π Stacking origin of irreversible dispersibility of graphene oxide. [PDF]

Nat Commun
Gao Y, Wang Y, Liao Y, Chang D, Peng L, Li R, Zhao X, Li K, Li H, Cao M, Li P, Liu Y, Ming X, Xu Z, Gao C, Xu Z.   +15 more
europepmc   +1 more source

Giant Tunneling Electroresistance and Anisotropic Photoresponse in Sliding Ferroelectric Homojunctions Based on Bilayer Janus MoSSe. [PDF]

Nanomaterials (Basel)
Yang H, Xu Y.
europepmc   +1 more source

Some of the next articles are maybe not open access.

Related searches:

To Stack or Not To Stack

2019 28th International Conference on Parallel Architectures and Compilation Techniques (PACT), 2019
3D memory technology, such as Micron's hybrid memory cube (HMC), has re-energized the architectural pursuit of computation very close to, or inside the memory chip. Such a design falls into the broader category of near-data processing (NDP). The motivation for such design is because the current Von Neumann architecture of chip-multiprocessors is ...
Richard Afoakwa, Lejie Lu, Hui Wu 0007, Michael C. Huang 0001   +3 more
openaire   +1 more source

Three stacks

[Proceedings 1988] 29th Annual Symposium on Foundations of Computer Science, 1988
Summary: Maintaining two stacks in memory is easily accomplished by placing them at opposite ends of memory and having them grow towards each other. The entire memory is readily available for stack items with this approach. Maintaining three stacks, however, presents more difficulty.
Michael L. Fredman, Deborah L. Goldsmith
openaire   +2 more sources