Results 151 to 160 of about 19,938 (266)

Characterization and Design Framework for Micro‐ and Nanoscale Printed Metal Interconnects in Hybrid Electronic Systems

open access: yesAdvanced Materials Technologies, EarlyView.
This work establishes a framework for high‐resolution printed interconnects by coupling e‐jet printing control, multilayer deposition, and sintering optimization. Ink properties and printing speed influence particle stacking, while different sintering atmospheres drive distinct microstructural evolution.
Kaifan Yue   +6 more
wiley   +1 more source

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

open access: yesAdvanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu   +8 more
wiley   +1 more source

3D Printed PEDOT:PSS‐Based Lattice Pressure Sensors With Tunable Electromechanical Response

open access: yesAdvanced Materials Technologies, EarlyView.
poly(3,4‐ethylenedioxythiophene): polystyrene sulfonate (PEDOT:PSS)‐based architected lattices are fabricated via single‐step Digital Light Processing (DLP) printing for tunable pressure sensing. Structural design variations allow precise control of sensitivity and range, while integrated conductivity eliminates post‐processing.
Ozan Karakaya   +9 more
wiley   +1 more source

Lead‐Free Bismuth Halide Perovskite Memristors: Low‐Voltage Switching and Physical Modeling of Resistive Hysteresis

open access: yesAdvanced Materials Technologies, EarlyView.
Lead‐free bismuth halide perovskite memristors exhibit stable low‐voltage resistive switching behavior. The conductance‐activated quasi‐linear memristor model quantitatively reproduces the experimental hysteresis, confirming ion migration‐driven filament dynamics.
So‐Yeon Kim   +4 more
wiley   +1 more source

Mechanical Fatigue in Liquid‐Metal Interconnects: Failure Mechanism Analysis and Validation of Improvement Strategies

open access: yesAdvanced Materials Technologies, EarlyView.
Multi‐million cycle reliability for liquid metal stretchable electronics is achieved through a continuous cycle of mechanical testing, failure mode and mechanism analysis and implementing subsequent mitigation strategies. ABSTRACT Stretchable electronics that combine mechanical compliance with reliable electrical performance are essential for ...
Lennert Purnal   +8 more
wiley   +1 more source

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