Results 251 to 260 of about 161,376 (364)

Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives

open access: yesAdvanced Materials Technologies, EarlyView.
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley   +1 more source

High strength and plasticity in disordered multilayer graphene reinforced copper composites. [PDF]

open access: yesNat Commun
Geng Y   +10 more
europepmc   +1 more source

Mechanical Fatigue in Liquid‐Metal Interconnects: Failure Mechanism Analysis and Validation of Improvement Strategies

open access: yesAdvanced Materials Technologies, EarlyView.
Multi‐million cycle reliability for liquid metal stretchable electronics is achieved through a continuous cycle of mechanical testing, failure mode and mechanism analysis and implementing subsequent mitigation strategies. ABSTRACT Stretchable electronics that combine mechanical compliance with reliable electrical performance are essential for ...
Lennert Purnal   +8 more
wiley   +1 more source

Engineered Microfluidic Organoid Systems: New Paradigms for Menopause Mechanism Research and Personalized Medicine

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores the integration of microfluidic technology with organoid systems as an innovative platform for studying menopausea complex multi‐organ condition. By enabling precise simulation of inter‐organ communication and hormone responses, microfluidic organoids offer a physiologically relevant model for investigating menopausal syndrome and ...
Qianyi Zhang   +4 more
wiley   +1 more source

Recyclable and Binder‐Free EGaIn–Carbon Liquid Metal Composite: A Sustainable Approach for High‐Performance Stretchable Electronics, Thermal‐Interfacing and EMI‐Shielding

open access: yesAdvanced Materials Technologies, EarlyView.
Binder‐free EGaIn–CB composite deliver printable, recyclable liquid‐metal conductors without sintering or polymer binders. Only 1.5 wt% CB yields shear‐thinning, high‐viscosity rheology, ∼60% bulk EGaIn conductivity, robust stretchability, high thermal conductivity, and strong EMI shielding (35 → 70 dB at 100% strain).
Elahe Parvini   +4 more
wiley   +1 more source

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