Results 71 to 80 of about 18,372 (261)

Annealing Process and Product Characteristics of Baosteel's Semi-process Non-oriented Electrical Steel with Coating

open access: yesTeshugang, 2008
The products B50A700T(≤0.003C,1.25~0.65Si)and B50A1300T(≤0.003C,0.50~0. 15Si)of scmi-process non-oriented electrical steel with coating are produced by hot metal pretreatment-top and bottom combined blowing converter-RH-CC-hot rolling-cold rolling ...
陈晓
doaj  

Self‐Assembled Monolayers in p–i–n Perovskite Solar Cells: Molecular Design, Interfacial Engineering, and Machine Learning–Accelerated Material Discovery

open access: yesAdvanced Materials, EarlyView.
This review highlights the role of self‐assembled monolayers (SAMs) in perovskite solar cells, covering molecular engineering, multifunctional interface regulation, machine learning (ML) accelerated discovery, advanced device architectures, and pathways toward scalable fabrication and commercialization for high‐efficiency and stable single‐junction and
Asmat Ullah, Ying Luo, Stefaan De Wolf
wiley   +1 more source

Multifunctional Bio‐Based Packaging for Perishable Foods: Structural Design, Scalable Fabrication, and Versatile Applications

open access: yesAdvanced Materials, EarlyView.
An overview of design principles and scalable fabrication strategies for multifunctional bio‐based packaging. Radiative cooling films, modified‐atmosphere films/membranes, active antimicrobial/antioxidant platforms, intelligent optical/electrochemical labels, and superhydrophobic surfaces are co‐engineered from material chemistry to mesoscale structure
Lei Zhang   +6 more
wiley   +1 more source

Elastic Properties in Tension and Shear of High Strength Nonferrous Metals and Stainless Steel - Effect of Previous Deformation and Heat Treatment [PDF]

open access: yes
A resume is given of an investigation of the influence of plastic deformation and of annealing temperature on the tensile and shear elastic properties of high strength nonferrous metals and stainless steels in the form of rods and tubes.
Mcadam, D J, Mebs, R W
core   +1 more source

New‐Era Polymer Thermoelectrics: Material Innovations, Doping Frontiers, Decoupling Strategies, and Unconventional Applications

open access: yesAdvanced Materials, EarlyView.
The field of polymer thermoelectrics is entering a new era, featuring breakthroughs in addressing the conventional performance disparity between p‐type and n‐type polymers, pioneering doping frontiers, and sophisticated decoupling strategies. This review explores innovations in molecular design and superior stabilities, bridging the gap from ...
Suhao Wang
wiley   +1 more source

Bend transition temperature of arc-cast molybdenum and molybdenum - 0.5-percent- titanium sheet in worked, recrystallized, and welded conditions [PDF]

open access: yes
Bend transition temperature of arc-cast worked, recrystallized, and welded molybdenum and molybdenum-titanium alloy ...
Sinclair, J. H.
core   +1 more source

Neuromorphic Electronics for Intelligence Everywhere: Emerging Devices, Flexible Platforms, and Scalable System Architectures

open access: yesAdvanced Materials, EarlyView.
The perspective presents an integrated view of neuromorphic technologies, from device physics to real‐time applicability, while highlighting the necessity of full‐stack co‐optimization. By outlining practical hardware‐level strategies to exploit device behavior and mitigate non‐idealities, it shows pathways for building efficient, scalable, and ...
Kapil Bhardwaj   +8 more
wiley   +1 more source

Cavitation Erosion Performance of the INCONEL 625 Superalloy Heat-Treated via Stress-Relief Annealing

open access: yesApplied Sciences
Cavitation-induced degradation of metallic materials presents a significant challenge for engineers and users of equipment operating with high-velocity fluids.
Robert Parmanche   +5 more
doaj   +1 more source

Evolution in Surface Morphology of Epitaxial Graphene Layers on SiC Induced by Controlled Structural Strain

open access: yes, 2008
The evolution in the surface morphology of epitaxial graphene films and 6H-SiC(0001) substrates is studied by electron channeling contrast imaging. Whereas film thickness is determined by growth temperature only, increasing growth times at constant ...
Carlo Carraro   +4 more
core   +1 more source

Characterization Of Thermal Stresses And Plasticity In Through-Silicon Via Structures For Three-Dimensional Integration [PDF]

open access: yes, 2014
Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause ...
Ho, P. S.   +4 more
core   +1 more source

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