Results 171 to 180 of about 2,196,068 (340)
Basic transformation operations which preserve computed answer substitutions of logic programs
, 1993 Annalisa Bossi, Nicoletta Cocco
openalex +1 more source
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Advanced Materials Technologies, EarlyView.Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek +4 more
wiley +1 more source
DynBlock: dynamic data encryption with Toffoli gate for IoT. [PDF]
Sci RepHaq M +6 more
europepmc +1 more source
Advanced Materials Technologies, EarlyView.This review highlights recent advancements in 3DP techniques that incorporate emerging multifunctional SMP materials for applications in e‐electronics, soft actuators, biomedical devices, and more. Abstract Shape memory polymers (SMP) have recently gained significant attention as multifunctional materials for flexible and wearable electronics ...
Muhammad Yasir Khalid +4 more
wiley +1 more source
Correspondence on "The Stockholm Convention at a Crossroads: Questionable Nominations and Inadequate Compliance Threaten Its Acceptance and Utility". [PDF]
Environ Sci TechnolScheringer M +9 more
europepmc +1 more source
Support for Universal Design by VR-incorporated Substitutive Experience Based on Fuzzy Logic
, 2002 Masahiro Yamada +3 more
openalex +2 more sources
How to Manufacture Photonic Metamaterials
Advanced Materials Technologies, EarlyView.Metamaterials boast applications such as invisibility and “hyperlenses” with resolution beyond the diffraction limit, but these applications haven’t been exploited in earnest and the market for them hasn’t grown much likely because facile and economical methods for fabricating them without defect has not emerged.
Apurba Paul, Gregory Timp
wiley +1 more source
Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications
Advanced Materials Technologies, EarlyView.Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley +1 more source
Simulation, synthesis, and characterization of Ni-Co and its co-doping in ZnO for energy applications. [PDF]
RSC AdvHien NC +7 more
europepmc +1 more source