Results 221 to 230 of about 6,240,497 (308)

Why Seizures Break Through: Distinguishing Background Susceptibility From Proximal Precipitants in Patients With Epilepsy. [PDF]

Cureus
Fadel M, Fadel A, Jwaida NR, Tabaac B.
europepmc   +1 more source

Influence of Scan Strategies in Electron Beam Powder Bed Fusion on Solidification, Microstructure, and High‐Temperature Compressive Properties of γ′‐Strengthened Inconel 738LC

Advanced Engineering Materials, EarlyView.
Experiments and thermophysical simulations were conducted to investigate the electron beam powder bed fusion electron beam (PBF‐EB/M) process for the γ′‐strengthened nickel‐based superalloy Inconel 738LC. The results demonstrate the impact of process‐induced microstructural variations on high‐temperature mechanical behavior, providing a basis for ...
Jan Niklas Petenati, Karthik Kumar Banku, Prasanth Bondi, Ivan Zhirnov, Yangyiwei Yang, Gordon Schmidt, Jürgen Christen, Georg Hasemann, Manja Krüger, Bai‐Xiang Xu, Bilal Gökce, Silja‐Katharina Rittinghaus   +11 more
wiley   +1 more source

Evaluation of eravacycline susceptibility testing by MIC test strip and disk diffusion against broth microdilution in carbapenem-resistant Enterobacterales. [PDF]

Front Cell Infect Microbiol
Wang K, Tian J, Wu T, Dong C, Wang X, Feng Q, Zhang Z.   +6 more
europepmc   +1 more source

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

Advanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz, Jonas Fell, Hendrik Jost, Stefan Diebels, Hans‐Georg Herrmann   +4 more
wiley   +1 more source

Early-Onset Neonatal Sepsis Caused by <i>Globicatella sanguinis/sulfidifaciens</i> : Case Report. [PDF]

AJP Rep
Otieno FO, Fonseca R, Aigbibvalu L.
europepmc   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Multidrug resistance and biofilm formation among bacterial isolates from chronic wounds in animals: evaluation of anti-biofilm activity. [PDF]

Front Vet Sci
Arbab S, Ullah H, Suleman, Almehmadi M, Allahyani M, Aljuaid A, Jambi K, Halawi MH, Feng C.   +8 more
europepmc   +1 more source

Leveraging Symbolic Artificial Intelligence and Fuzzy Logic for Materials Science: A Review of Methods, Challenges, and Applications to Scarce and Imperfect Experimental Data

Advanced Engineering Materials, EarlyView.
This article explores the transformative potential of symbolic artificial intelligence (AI) in the field of materials science, particularly in leveraging experimental data. The article presents several symbolic AI models and discusses their applications in materials science.
Ahmed Amrani, Mohamed‐Ali Belloum, Laurence Boudet, Valentin Fouillard, Edwin Friedmann, Guillaume Lacharme, Ali Mahmoud, Jean‐Philippe Poli   +7 more
wiley   +1 more source

Phage Genomics and Bioinformatics in Therapeutic Development: Evidence Limits, Validation Gates, and Translational Decision-Making. [PDF]

Pharmaceuticals (Basel)
Ang MY, Chen L, Song L, Lipovich L, Choo SW.   +4 more
europepmc   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source