Results 41 to 50 of about 622 (69)
Polynomial accelerated solutions to a LARGE Gaussian model for imaging biofilms: in theory and finite precision. [PDF]
J Am Stat Assoc, 2018 Parker AE +3 more
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GPU computing with Kaczmarz's and other iterative algorithms for linear systems. [PDF]
Parallel Comput, 2010 Elble JM, Sahinidis NV, Vouzis P.
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EEG/MEG source imaging: methods, challenges, and open issues. [PDF]
Comput Intell Neurosci, 2009 Wendel K +10 more
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Pore-scale modeling of pore structure effects on P-wave scattering attenuation in dry rocks. [PDF]
PLoS One, 2015 Wang Z, Wang R, Li T, Qiu H, Wang F.
europepmc +1 more source
Solvers for the cardiac bidomain equations. [PDF]
Prog Biophys Mol Biol, 2008 Vigmond EJ +4 more
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Generalized and novel iterative scheme for best approximate solution of large and sparse augmented linear systems. [PDF]
HeliyonAlomair AM, Shah FA, Ahmed K, Waseem M.
europepmc +1 more source
A unique electrical resistivity experiment reveals the 3D interior of Piton de la Fournaise. [PDF]
Sci RepGailler L +7 more
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Some of the next articles are maybe not open access.
Exploration Geophysics, 2017
The subsurface three-dimensional (3D) model of density distribution is obtained by solving an under-determined linear equation that is established by gravity data. Here, we describe a new fast gravity inversion method to recover a 3D density model from gravity data.
Zhaohai Meng +4 more
openaire +1 more source
The subsurface three-dimensional (3D) model of density distribution is obtained by solving an under-determined linear equation that is established by gravity data. Here, we describe a new fast gravity inversion method to recover a 3D density model from gravity data.
Zhaohai Meng +4 more
openaire +1 more source
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015
Thermal issue is a leading design constraint for three-dimensional integrated circuits (3D-ICs) and through silicon vias (TSVs) are used to reduce the temperature of 3D-ICs effectively. In this paper, the finite difference method-based heat conduction equations is proposed for the thermal analysis of the TSV structures in 3D-ICs and generalized minimum
Jianping Zhu +3 more
openaire +1 more source
Thermal issue is a leading design constraint for three-dimensional integrated circuits (3D-ICs) and through silicon vias (TSVs) are used to reduce the temperature of 3D-ICs effectively. In this paper, the finite difference method-based heat conduction equations is proposed for the thermal analysis of the TSV structures in 3D-ICs and generalized minimum
Jianping Zhu +3 more
openaire +1 more source
Treatment of muscle‐invasive and advanced bladder cancer in 2020
Ca-A Cancer Journal for Clinicians, 2020Vaibhav G Patel +2 more
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