Results 231 to 240 of about 6,764,527 (311)
Visible-Light Hyperspectral Reconstruction and PCA-Based Feature Extraction for Malignant Pleural Effusion Cytology. [PDF]
Lai CL +7 more
europepmc +1 more source
Lipid balance and chemoresistance in cancer cells. [PDF]
Kanemaru K, Nakamura Y.
europepmc +1 more source
Some of the next articles are maybe not open access.
Related searches:
Related searches:
Journal of materials in civil engineering, 2019
Concrete structures that employed general and multicomponent blended binders were constructed using a low-carbon, ecofriendly microwave heat curing technology with the aim of accelerating t...
T. Koh +5 more
semanticscholar +1 more source
Concrete structures that employed general and multicomponent blended binders were constructed using a low-carbon, ecofriendly microwave heat curing technology with the aim of accelerating t...
T. Koh +5 more
semanticscholar +1 more source
Performance analysis: D-Latch modules designed using 18nm FinFET Technology
2020 International Conference on Smart Electronics and Communication (ICOSEC), 2020In general, a latch also known as level triggered device is used to store single bit information. Also, the latch is considered as a building block for sequential circuits.
Rajeev Ratna Vallabhuni +3 more
semanticscholar +1 more source
AT&T next generation digital cellular base station technology
International Symposium on Switching, 2005Cellular telecommunications is growing at a rapid rate throughout the world since its introduction in the United States by AT&T in 1981. Current usage within the United States has reached the two millionth customer mark and is still expanding. Market forcasters expect cellular customer usage to grow to 78 to 20 million subscribers by mid-year 1993 ...
R.W. Henn, R.S. Kerby, J.E. Russell
openaire +1 more source
Generic packaging technologies for T/R-modules
2005 European Microwave Conference, 2005This paper presents some recent evaluations of packaging technologies for T/R modules over a broad frequency range. The report also presents some examples of hardware demonstrators using the described technologies. The used methodologies are sub-divided into carrier substrates, component interconnection and packaging, heat transfer methods, mechanical ...
openaire +1 more source

