Results 231 to 240 of about 6,764,527 (311)

Visible-Light Hyperspectral Reconstruction and PCA-Based Feature Extraction for Malignant Pleural Effusion Cytology. [PDF]

open access: yesBiosensors (Basel)
Lai CL   +7 more
europepmc   +1 more source

Women's Occupational Tobacco Dust Exposure in Indonesia (T-CHARM): Protocol for a Prospective Cohort Study.

open access: yesJMIR Res Protoc
Marchianti ACN   +9 more
europepmc   +1 more source
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Application of Low-Carbon Ecofriendly Microwave Heat Curing Technology to Concrete Structures Using General and Multicomponent Blended Binder

Journal of materials in civil engineering, 2019
Concrete structures that employed general and multicomponent blended binders were constructed using a low-carbon, ecofriendly microwave heat curing technology with the aim of accelerating t...
T. Koh   +5 more
semanticscholar   +1 more source

Performance analysis: D-Latch modules designed using 18nm FinFET Technology

2020 International Conference on Smart Electronics and Communication (ICOSEC), 2020
In general, a latch also known as level triggered device is used to store single bit information. Also, the latch is considered as a building block for sequential circuits.
Rajeev Ratna Vallabhuni   +3 more
semanticscholar   +1 more source

AT&T next generation digital cellular base station technology

International Symposium on Switching, 2005
Cellular telecommunications is growing at a rapid rate throughout the world since its introduction in the United States by AT&T in 1981. Current usage within the United States has reached the two millionth customer mark and is still expanding. Market forcasters expect cellular customer usage to grow to 78 to 20 million subscribers by mid-year 1993 ...
R.W. Henn, R.S. Kerby, J.E. Russell
openaire   +1 more source

Generic packaging technologies for T/R-modules

2005 European Microwave Conference, 2005
This paper presents some recent evaluations of packaging technologies for T/R modules over a broad frequency range. The report also presents some examples of hardware demonstrators using the described technologies. The used methodologies are sub-divided into carrier substrates, component interconnection and packaging, heat transfer methods, mechanical ...
openaire   +1 more source

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