Results 181 to 190 of about 40,715 (248)

Influence of Scan Strategies in Electron Beam Powder Bed Fusion on Solidification, Microstructure, and High‐Temperature Compressive Properties of γ′‐Strengthened Inconel 738LC

open access: yesAdvanced Engineering Materials, EarlyView.
Experiments and thermophysical simulations were conducted to investigate the electron beam powder bed fusion electron beam (PBF‐EB/M) process for the γ′‐strengthened nickel‐based superalloy Inconel 738LC. The results demonstrate the impact of process‐induced microstructural variations on high‐temperature mechanical behavior, providing a basis for ...
Jan Niklas Petenati   +11 more
wiley   +1 more source

Effects of waterlogging on pollutant availability in iron mining tailings and the tolerance response of Typha domingensis Pers. [PDF]

open access: yesEnviron Sci Pollut Res Int
de Anchieta MR   +6 more
europepmc   +1 more source

High‐Temperature Phase Transformation in a V‐9Si‐6.5B Alloy: The Kinetic and Crystallographic Pathway From V5SiB2 to V8SiB4

open access: yesAdvanced Engineering Materials, EarlyView.
In situ synchrotron high‐energy X‐ray diffraction reveals the real‐time high‐temperature phase evolution of a ternary V‐9Si‐6.5B alloy. The study uncovers a kinetically delayed V5SiB2 → V8SiB4 transformation governed by massive structural and chemical barriers.
Zahra Sabeti   +4 more
wiley   +1 more source

The Role of Ultra‐Thin Passive Films and Organic Adsorbates on Aluminum Chips for a Friction‐Induced Solid‐State Recycling Process

open access: yesAdvanced Engineering Materials, EarlyView.
Despite benefits to storage stability and handleability of aluminum scrap, octadecyl phosphonic acid (ODPA) SAMs reduce the tensile strength of wires produced using friction‐induced recycling. Etching and methyl diphosphonic acid (MDPA) coatings, however, have little effect.
Timothy D. Goller   +3 more
wiley   +1 more source

Influence of Particle Shape and Size in Copper‐Based Low‐Temperature Metallization Paste for Solar Cells

open access: yesAdvanced Engineering Materials, EarlyView.
Particle morphology controls the balance between printability and electrical connectivity in low‐temperature AgCu/Ag metallization pastes. Flake‐shaped AgCu particles form extended low‐resistance contacts, whereas spherical particles favor processability at high metal loading. Fine Ag particles further tune void filling and conductive‐network formation
O. Mhirsi   +3 more
wiley   +1 more source

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