Refining the Carbide Size in AISI M50 High-Speed Steel Through Tailored Compositional Modifications. [PDF]
Yang P, Xie X, Yang C, Hui X, Liu T.
europepmc +1 more source
Atomic Layer Deposition in Transistors and Monolithic 3D Integration
Transistors are fundamental building blocks of modern electronics. This review summarizes recent progress in atomic layer deposition (ALD) for the synthesis of two‐dimensional (2D) metal oxides and transition‐metal dichalcogenides (TMDCs), with particular emphasis on their enabling role in monolithic three‐dimensional (M3D) integration for next ...
Yue Liu +5 more
wiley +1 more source
Optimization of mechanical properties and microstructure characterization of resistance spot welded martensitic stainless steel: in-situ tempering and TLBO approach. [PDF]
Gurav V, Shrivastava D.
europepmc +1 more source
Polymer Network Modified Perovskite for High‐Performance Pure Blue Light‐Emitting Diodes
A polymer network of poly(4‐vinylphenol) (PVPh) is introduced to improve pure blue perovskite light‐emitting diodes. PVPh effectively passivates defects, enhances film morphology, reduces lattice strain, and suppresses ion migration. These effects lead to record device performance, achieving 9.82% external quantum efficiency and stable blue emission at
Zhongkai Yu +11 more
wiley +1 more source
Multi‐Functional ZnO–Te Heterojunction Devices Enabling Compact Frequency Quadrupler
Wafer‐scale ZnO–Te heterojunction devices featuring tunable double negative differential transconductance (D‐NDT) are demonstrated at ≤ 200°C. Leveraging this unique characteristic, a single‐stage frequency quadrupler is realized, achieving a 64%–75% reduction in device count.
Jae Hyeon Jun +8 more
wiley +1 more source
Direct contact ultrasound tempering of frozen pork: Effects on physicochemical properties, myofibrillar protein and microstructure. [PDF]
You X +9 more
europepmc +1 more source
The hidden role of Cd segregation at grain boundaries is revealed in p‐type Mg3Sb2 by atom probe tomography and other advanced characterizations. Grain boundary Cd enrichment suppresses the SbMg+ hole‐killer formation and lowers potential barriers, enhancing electrical conductivity.
Zhou Li +12 more
wiley +1 more source
Construction of a Gradient Nanostructure for Enhanced Surface Properties in 38CrMoAl Steel via Ultrasonic Severe Surface Rolling. [PDF]
Han J +9 more
europepmc +1 more source
Charge transport in 2D tin perovskite FETs is shown to be governed by dielectric interface behavior. Polar polymer dielectrics induce dipolar disorder that localizes carriers, whereas nonpolar polymers suppress trapping and enable superior charge transport, ensuring stable and reliable transistor operation. ABSTRACT Understanding the role of interfaces
Chongyao Li +5 more
wiley +1 more source
Comparative Study of Different Additive Manufacturing Methods for H13 Tool Steel. [PDF]
Widomski P +4 more
europepmc +1 more source

