Results 181 to 190 of about 192,490 (261)

From Copper Nanoparticles to Alumina Encapsulated Porous Layers With Enhanced Mechanical Stability

open access: yesAdvanced Materials Interfaces, EarlyView.
This study analyzes the synthesis‐structure relation of individual Cu nanoparticles and highly porous nanoparticle‐based Cu films using different sputtering‐based nanoparticle sources. The inherent mechanical instability of the films is tackled with Al2O3 encapsulation through atomic layer deposition, enabling 4‐fold increase in critical force in ...
Dominik Gutnik   +6 more
wiley   +1 more source

Optical Detection and Modeling of Lithium Deposition on Copper Current Collectors

open access: yesAdvanced Materials Interfaces, EarlyView.
ABSTRACT Understanding lithium (Li) deposition on copper (Cu) substrates is essential for improving the performance and lifetime of zero–excess lithium metal batteries. In this study, Li deposition was investigated under realistic coin–cell conditions using complementary scanning electron microscopy and laser scanning microscopy. A semi–automatic image
Tjark T. K. Ingber   +4 more
wiley   +1 more source

Scalable Layer‐by‐Layer Electrospray‐Assisted Interfacial Polymerization: Enabling Large‐Area Polyamide Membrane Fabrication

open access: yesAdvanced Materials Technologies, EarlyView.
We report a multi‐jet, layer‐by‐layer electrospray‐assisted interfacial polymerization (LBL‐EAIP) approach for the scalable fabrication of polyamide reverse osmosis (RO) membranes. The method enables precise control of polymerization, uniform polyamide coverage, and tunable polyamide film thickness, while delivering consistently high filtration ...
Yue Feng   +5 more
wiley   +1 more source

Characterization and Design Framework for Micro‐ and Nanoscale Printed Metal Interconnects in Hybrid Electronic Systems

open access: yesAdvanced Materials Technologies, EarlyView.
This work establishes a framework for high‐resolution printed interconnects by coupling e‐jet printing control, multilayer deposition, and sintering optimization. Ink properties and printing speed influence particle stacking, while different sintering atmospheres drive distinct microstructural evolution.
Kaifan Yue   +6 more
wiley   +1 more source

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

open access: yesAdvanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu   +8 more
wiley   +1 more source

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