Results 151 to 160 of about 1,230,272 (294)

Built‐In Interfacial Electric Field in Hydroxyl‐Terminated MXene/COF Heterostructures for Enhanced Solid‐State Supercapacitors

open access: yesAdvanced Functional Materials, EarlyView.
Hydroxyl‐terminated MXene is integrated with a redox‐active covalent organic framework through electrostatic self‐assembly followed by hydrothermal treatment to construct MXene/COF heterostructures with a built‐in interfacial electric field. Termination‐controlled interfacial electronic modulation induces charge redistribution and favorable band ...
Cheru Fekadu Molla   +4 more
wiley   +1 more source

Fast Track to the Overdoped Regime of Superconducting YBa2Cu3O7‐δ Thin Films via Electrochemical Oxidation

open access: yesAdvanced Functional Materials, EarlyView.
Overdoping high temperature superconductors, such as YBa2Cu3O7‐δ (YBCO), is expected to maxime the critical current density by optimising the condensation energy for a given defect landscape, providing new thrust for the development of fusion enabling coated conductors. Here, precise oxygen control is achieved via an electrochemical method allowing for
Alexander Stangl   +7 more
wiley   +1 more source

Unlocking Multi‐Valley Energy Pockets and Interface‐Induced Phonon Filtering in InSb Thermoelectrics by Reaction‐Driven Interface Engineering

open access: yesAdvanced Functional Materials, EarlyView.
InSb, a narrow‐bandgap semiconductor with high carrier mobility, is promising for thermoelectric energy conversion but suffers from high lattice thermal conductivity and strong bipolar conduction. Here, in situ interface engineering using Co2O3 nanoprecursors forms hierarchical CoSbx/In2O3/CoSb3 heterostructures that enhance phonon scattering and ...
Jiwu Xin   +10 more
wiley   +1 more source

Design Strategies and Emerging Applications of High‐Performance Flexible Piezoresistive Pressure Sensors

open access: yesAdvanced Functional Materials, EarlyView.
Flexible piezoresistive pressure sensors underpin wearable and soft electronics. This review links sensing physics, including contact resistance modulation, quantum tunneling and percolation, to unified materials/structure design. We highlight composite and graded architectures, interfacial/porous engineering, and microstructured 3D conductive networks
Feng Luo   +2 more
wiley   +1 more source

The Floor‐Ceiling‐Chip, or 2 × 2D = Pseudo‐3D—Approaching 3D Cell Morphology and Organization between Two Opposing 2D Substrates with Cell‐Adhesive Protein Micropatterns

open access: yesAdvanced Healthcare Materials, EarlyView.
Here, we present a novel 3D cell patterning and culture platform. The “Floor‐Ceiling‐Chip” (FC‐Chip) consists of two opposing track‐etched membranes, creating a pseudo‐3D microenvironment for the cells in between. By providing the membranes with micropatterned cell‐adhesive islands of varying geometries and sizes, the FC‐Chip enables control over cell ...
Urandelger Tuvshindorj   +10 more
wiley   +1 more source

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