Results 111 to 120 of about 746,515 (283)
The lower electromechanical performance of lead-free piezoelectric materials remains a critical bottleneck impeding their ability to replace lead-based materials in energy harvesting.
Caixia Zhu +5 more
doaj +1 more source
Hybrid piezoelectric scaffolds offer a promising route for Central Nervous System regeneration by combining structural and electrical cues to support neural stem cell growth. This review highlights their potential to overcome current challenges in neural tissue engineering by exploring porous hybrid materials, their biological interactions, and ...
Heather F. Titterton +2 more
wiley +1 more source
Picosecond laser machined designed patterns with anti-ice effect [PDF]
Micromachining using ultra short laser pulses (USLP) has evolved over the past years as a versatile tool for introducing functional features in surfaces at a micrometric and even at a sub wavelength scale.
Arnaldo del Cerro, Daniel +2 more
core +1 more source
This study reports the first implantable resin cement capable of orientation‐sensitive Magnetic Particle Imaging (MPI). By coating the cement with an ultrathin iron film, the authors achieve a strong, angle‐dependent MPI signal that enables non‐ionizing, real‐time tracking of both implant position and orientation, opening new possibilities for safe ...
Gabriel C. Pinto +10 more
wiley +1 more source
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya +2 more
wiley +1 more source
UV laser irradiation (lambda = 193 nm), below and above damage thresholds, is used to both alter and pattern the surface properties of borosilicate slides to tune and control the contact angle of a water drop over the surface.
Canning, John +4 more
core +1 more source
Porous textured ceramics with controlled grain size and orientation [PDF]
R. Behera +3 more
semanticscholar +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
This critical review presents a comprehensive roadmap for the precision 3D printing of cellulose. Quantitative correlations link ink formulation and rheological properties to print fidelity and final material performance. This framework guides the development of advanced functional materials, from biomedical scaffolds to electromagnetic shielding ...
Majed Amini +3 more
wiley +1 more source

