Results 251 to 260 of about 914,670 (330)

Tunable Plasmonic Response of Silver Nanoparticles Entangled in Detonation Nanodiamond Network via Colloidal Self‐Assembly

open access: yesAdvanced Materials Interfaces, EarlyView.
Detonation nanodiamonds form a network that entangles silver nanoparticles into stable nanocomplexes. The structure can fine‐tune and enhance plasmonic absorption through nearfield electromagnetic interactions but prevents silver particle aggregation. The study shows how the arrangement and concentration of particles affect light absorption, offering a
Vendula Hrnčířová   +4 more
wiley   +1 more source

Distance-resilient conductivity in p-doped polythiophenes.

open access: yesMater Horiz
Röck E   +10 more
europepmc   +1 more source

Polystyrene/TiO2 Composite Thin Films by Powder Aerosol Deposition: Film Morphology Control Through Powder Processing

open access: yesAdvanced Materials Interfaces, EarlyView.
It's all in the mix! By employing different homogenization strategies for preparing polystyrene/TiO2 polymer‐ceramic composite (PCC) powders, we tune the morphology of PCC films obtained by powder aerosol deposition, ranging from segregated multilayer‐like to finely blended composites.
Marc C. Thiel   +5 more
wiley   +1 more source

Treatment with Plasma Activated (Salt) Water Sterilizes Macromolecular Coatings While Maintaining Their Integrity and Functionality

open access: yesAdvanced Materials Interfaces, EarlyView.
PDMS samples were covalently coated with mucin glycoproteins and then treated with either plasma activated water (PAW) or saline (PAS) as a means of disinfection. The samples could be successfully sterilized without compromising the structural integrity or functionality of those coatings.
Bernardo Miller Naranjo   +4 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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