Results 181 to 190 of about 132,485,236 (247)
Physicochemical, Predicted ADME, and Structural Positioning of Azelaic Acid Within an Endocrine Oncology Reference Framework. [PDF]
Jurj ED +5 more
europepmc +1 more source
Rotary 3D Printing With Integrated Electroplating
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria +5 more
wiley +1 more source
Multivariate connectivity deviations reveal task-evoked and clinical network reorganization. [PDF]
Kröll JP +8 more
europepmc +1 more source
Additive manufacturing introduces pronounced microstructural and crystallographic anisotropy in Ni‐based superalloys, resulting in orientation‐dependent creep deformation and damage. This review identifies the key microstructural origins of creep anisotropy, examines their influence on dominant deformation mechanisms, and highlights processing ...
Chandan Kumar +3 more
wiley +1 more source
Infant Movement Classification Using Pose-Based Motion Features and a Learned Hybrid k-Nearest Neighbor Model. [PDF]
Ari A +7 more
europepmc +1 more source
Impact of Hydrogen Incorporation on Electronic and Magnetic Structure of X2CrNi18‐9 Stainless Steel
Hydrogen uptake in austenitic stainless steel alters both its electronic and magnetic structure. Seebeck measurements reveal hydrogen‐induced shifts in the electronic density of states, while neutron scattering uncovers nanoscale inhomogeneities that grow upon hydrogen incorporation, with the most pronounced effect observed in the PBF as‐built state ...
Torben Tappe +9 more
wiley +1 more source
EmmaEmb: A quantitative framework for analyzing embedding spaces in molecular biology. [PDF]
Rissom PF +7 more
europepmc +1 more source
Particle morphology controls the balance between printability and electrical connectivity in low‐temperature AgCu/Ag metallization pastes. Flake‐shaped AgCu particles form extended low‐resistance contacts, whereas spherical particles favor processability at high metal loading. Fine Ag particles further tune void filling and conductive‐network formation
O. Mhirsi +3 more
wiley +1 more source

