Results 131 to 140 of about 1,531,336 (278)

Quality Enhancement of Laser Powder‐Bed Fusion Parts by Acoustically Assisted Additive Manufacturing by Laser Powder‐Bed Fusion and its Application to Lattice Structures

open access: yesAdvanced Engineering Materials, EarlyView.
Additive manufacturing technologies like laser powder‐bed fusion offer great design freedom and individualization of products down to a batch size of one. However, parts fabricated with this technology suffer from poor quality. Acoustic assistance during the build process can minimize these drawbacks.
Oliver Maurer, Dirk Bähre
wiley   +1 more source

Information-Theoretic Concepts in Physics

open access: yesEntropy
The concepts of computation and information are becoming increasingly important, both in everyday life and in the sciences [...]
Michael E. Cuffaro, Stephan Hartmann
openaire   +3 more sources

First‐Principles Modeling of Solid Solution Softening and Hardening Effects in Al–Mg–Zr–Si Aluminum Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay   +3 more
wiley   +1 more source

Vacuum‐Formed Composites Based on a Polyolefin and a High Content of Biomass‐Waste Fillers

open access: yesAdvanced Engineering Materials, EarlyView.
It is shown here that by the use of a very ductile polymer matrix, it is possible to vacuum‐form products that contain up to 25% of hard biofillers with still ductile properties. The results are promising and opens up for the use of engineered biocomposites derived from industrial side‐stream biofillers in vacuum‐formed products. A strategy to increase
Susanna K. Källbom   +6 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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