Results 171 to 180 of about 62,678 (311)

Mimicking Silent Synapse Recruitment: A SiOx/Cu‐Pancake Memristive Device For Analog Neuromorphic Computing

open access: yesAdvanced Functional Materials, EarlyView.
Electroforming‐free TiN/SiOx/Cu/SiOx/TiN memristive devices exploit pancake‐like Cu nanoparticles embedded in a SiOx double layer to create a heterogeneous Schottky‐barrier landscape. Under bias, oxygen‐vacancy redistribution progressively lowers local barriers and recruits initially inactive Cu‐PC pathways into a parallel conduction ensemble, enabling
Rouven Lamprecht   +10 more
wiley   +1 more source

Characterization of Novel Partially Bio-Based, Waste-Derived Composites for Thermal and Acoustic Performance in Buildings. [PDF]

open access: yesPolymers (Basel)
Ali M   +6 more
europepmc   +1 more source

Interface Engineering via Sb2Te3 Deposition Enables High‐Performance SWCNT Film Thermoelectrics

open access: yesAdvanced Functional Materials, EarlyView.
SWCNTs are promising for flexible thermoelectrics but suffer from low performance. Here, cold‐pressed SWCNT films combined with deposited Sb2Te3 form engineered interfaces that enhance charge transport and energy filtering. The composite achieves a high power factor (25.82 µW cm−1 K−2) and delivers a power density of 3 mW cm−2 at ΔT = 40 K, with ...
Yuan‐Meng Liu   +11 more
wiley   +1 more source

3D‐Printable, Biodegradable, and Conductive/Piezoionic Hydrogel ‘E‐Skin’ With Robust Antibacterial Properties for Wound Healing and Wireless Human‐Machine Interface Sensing

open access: yesAdvanced Functional Materials, EarlyView.
A multifunctional MXene‐integrated GelMA/alginate hydrogel reinforced with TEMPO‐modified nanocellulose is engineered via dynamic covalent, ionic, and hydrogen bonding. The resulting piezoelectric, adhesive, antimicrobial, and 3D‐printable patch enables motion sensing and accelerates wound healing by promoting keratinocyte migration and collagen ...
Myoungjoon Jeon   +11 more
wiley   +1 more source

INFLUENCE OF STRUCTURE OF THERMAL INSULATING MATERIALS ON THE COEFFICIENT OF THERMAL CONDUCTIVITY

open access: yesIzvestiya Visshikh Uchebnykh Zavedenii. Chernaya Metallurgiya = Izvestiya. Ferrous Metallurgy, 2015
V. V. Sterligov, D. A. Shadrintseva
openaire   +2 more sources

Stacking Fault Complexions in AgSbTe2 Thermoelectrics With Enhanced Electrical Conductivity

open access: yesAdvanced Functional Materials, EarlyView.
Atomic‐scale characterization resolves stacking fault complexion in AgSbTe2, showing Te and Sb segregation along with lattice dilation. Their enhanced effects on phonon scattering are modeled analytically. Although most defects also impede electron transport, local four‐point‐probe measurements reveal higher electrical conductivity at stacking fault ...
Lamya Abdellaoui   +13 more
wiley   +1 more source

Programmable 2D Magnetic Clusterphenes With High Curie Temperature and Strong Magnetic Anisotropy via Cluster Assembly and Ligand Synergy

open access: yesAdvanced Functional Materials, EarlyView.
Programmable 2D magnetic clusterphenes are realized through a ligand‐mediated cluster‐assembly strategy. Direct linking of magnetic superatomic clusters enhances electron delocalization and symmetry breaking, enabling the concurrent strengthening of magnetic exchange interactions and spin–orbit coupling.
Junxiang Fu   +13 more
wiley   +1 more source

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