Results 191 to 200 of about 6,138,248 (244)

Programmable Crack Networks for Wide‐Range and Reversible Strain Sensing in Vertically Oriented van der Waals Molybdenum Disulfide Thin Films

open access: yesAdvanced Materials Technologies, EarlyView.
Vertically oriented van der Waals MoS2 thin films enable a mechanically programmable crack network for strain sensing. The initial mechanical programming protocol establishes a programmed crack configuration along weak interlayer and interdomain interfaces.
Yinli Wang, Hiroyuki Hirakata
wiley   +1 more source

A Constraint‐Based Analytical Framework for Design‐Space Analysis and Material Screening of Tubular Multilayer Dielectric Elastomer Pumps for Extracorporeal Circulatory Applications

open access: yesAdvanced Materials Technologies, EarlyView.
A constraint‐based analytical framework maps the coupled effects of material properties, structural parameters, and operating conditions in tubular dielectric elastomer pumps for extracorporeal circulatory applications. The approach defines performance boundaries through mechanical, electrical, and hydraulic constraints and identifies feasible design ...
Yan Zhang   +3 more
wiley   +1 more source

Air attenuation of high power XFEL beams. [PDF]

open access: yesJ Synchrotron Radiat
Heimann P   +11 more
europepmc   +1 more source

Copper Electroplated TPMS Polymer Lattices for Lightweight Absorption Dominant Electromagnetic Interference Shielding

open access: yesAdvanced Materials Technologies, EarlyView.
Copper electroplating transforms lightweight 3D‐printed TPMS polymer lattices into effective electromagnetic shields. Topology, relative density, and conductive seed layer continuity govern copper penetration, electrical resistance, and attenuation. SEA consistently exceeds SER, while 35% RD Diamond lattice gives the best performance, reaching 48.72 dB
Aman Al Khatib   +6 more
wiley   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju   +2 more
wiley   +1 more source

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