Results 171 to 180 of about 151,392 (262)

Tunable Negative Thermal Expansion in Fe/Cr-Substituted Nd₂Co₁₇ Compounds via Magnetoelastic Coupling. [PDF]

Adv Sci (Weinh)
Li J, Qv C, Tu H, Gu Q, Hutchison WD, Campbell SJ, Cheng Z, Wang W, Wang J.   +8 more
europepmc   +1 more source

Dynamically Actuated Reconfigurable Topographical Surface Enables Active Control of Implant‐Associated Infections

Advanced Functional Materials, EarlyView.
A dynamically actuated reconfigurable topographical surface (DARTS) integrates contact‐mediated bactericidal nanotopography with programmable mechanical actuation to actively disrupt bacterial biofilms. Dynamic surface reconfiguration enhances bacterial killing and suppresses implant‐associated infections in vivo, providing a new strategy for active ...
Mohammad Asadi Tokmedash, Jihun Lee, J. Scott VanEpps, Sungmin Nam, Jouha Min   +4 more
wiley   +1 more source

Dynamic pedal motion and thermal expansion in an ionic co-crystal with 1,2-bis(4-pyridyl) ethylene. [PDF]

RSC Adv
Zhang Y, Jiao Y, Guo Y, Cen P, Zhang Z, Liu X.   +5 more
europepmc   +1 more source

Balancing Hydrophobicity and Hydrophilicity: Dual Filler‐Engineered Proton Exchange Membranes for Durable, High‐Power Fuel Cells

Advanced Functional Materials, EarlyView.
Polarity‐matched Zr–MOFs program Nafion's nanoscale morphology during solution casting. Hydrophilic UiO‐66 preserves hydrated pathways, while hydrophobic UiO‐67 increases the proton hopping sites by densifying ionic clusters. Combining both fillers yields a membrane that delivers 176 mS cm−1 conductivity, reaches 1.46 W cm−2 under 200 kPa, and triples ...
Yonghwi Cho, Yunseong Ji, Minkyu Choi, Junsu Kim, Yejin Kim, Su Jeong Lee, Wooyoung Choi, Choong Hoo Lee, Ju Yeon Kim, Ohchan Kwon, Hanim Kim, Du Yeol Ryu, Ki Chul Kim, Dae Woo Kim   +13 more
wiley   +1 more source

Thermally responsive multistate fluorescence coupled with uniaxial negative thermal expansion in 1D lead halide hybrids. [PDF]

Chem Sci
Yang G, Ye W, Shen Y, Shao DS, Liu JL, Tian ZF, Ning W, Ren XM.   +7 more
europepmc   +1 more source

Chitin‐Derived Carbon‐Metal Functional Materials

Advanced Functional Materials, EarlyView.
Functional carbon materials are synthesized from combination of biopolymer (chitin) and iron precursors. The resultant material exhibits superior surface area and adsorptive properties compared to carbon materials synthesized directly from pure chitin.
Herry Fang, Chao Hsuan (Joseph) Sung, Haitao Yu, Ezra Sarmiento, Katarina Kotanchek, Ryan Christopher Lee, Michelle Chan, David Kisailus   +7 more
wiley   +1 more source

Coefficient of Thermal Expansion of AlSi10Mg, 316L Stainless Steel and Ti6Al4V Alloys Made with Laser Powder Bed Fusion. [PDF]

Materials (Basel)
Emanet S, Honu E, Agbewornu K, Quansah E, Zeng C, Mensah P.   +5 more
europepmc   +1 more source

Gradient‐Conductivity Architecture Enables Synchronous Enhancement of Sensitivity and Detection Range in Multifunctional All‐Paper Sensors

Advanced Functional Materials, EarlyView.
A gradient‐engineered all‐paper sensor is fabricated by integrating MXene and in situ grown AgNPs within hierarchical cellulose networks. The device breaks the sensitivity–detection range trade‐off through cascaded conductive pathways, enabling ultrahigh pressure sensitivity, humidity–pressure decoupled dual‐mode sensing, and outstanding EMI shielding,
Ao Li, Jun Xu, Dezhong Xu, Zhaohui Zhang, Jiyi Li, Daxian Cao, Kefu Chen, Mizi Fan   +7 more
wiley   +1 more source

Colossal Thermal Expansion and Continuous Rolling Locomotion of a Robust Flexible Molecular Single Crystal. [PDF]

J Am Chem Soc
Jing B, Kuang W, Li J, Zhang Y, Wu S, Li L, Naumov P, Gong J.   +7 more
europepmc   +1 more source

Emerging Post‐CMOS Hardware Neurons for Brain‐Inspired Computing: Devices, Circuits, and System Integration

Advanced Functional Materials, EarlyView.
The physical realization of artificial neurons is a critical challenge for energy‐efficient neuromorphic computing. This review presents a comprehensive analysis of the evolution of artificial neuron implementations from conventional CMOS to emerging post‐CMOS technologies.
Kannan Udaya Mohanan, Hocheon Yoo, Benoît H. Lessard, Ioannis Kymissis, Chang‐Hyun Kim   +4 more
wiley   +1 more source