Results 81 to 90 of about 53,337 (264)

Thermal expansion coefficient determination of polylactic acid using digital image correlation

E3S Web of Conferences, 2018
This paper aims determining the linear thermal expansion coefficient (CTE) of polylactic acid (PLA) using an optical method for measuring deformations called digital image correlation method (DIC).
Botean Adrian - Ioan
doaj   +1 more source

An Edible Chitosan‐Based Acoustic Sensor for Sound‐Responsive Actuation in Edible Robots

Advanced Functional Materials, EarlyView.
This study introduces an edible acoustic sensor for robotic food and edible robotics. Built from a chitosan piezoelectric film between gold electrodes, the sensor enables acoustic communication through ON/OFF keying. Integrated into an edible robot with pneumatically actuated arms and neck, it responds to high‐frequency tones.
Valerio Francesco Annese, Bokeon Kwak, Gaia de Marzo, Giulia Coco, Valentina Antonaci, Leonardo Lamanna, Massimo De Vittorio, Dario Floreano, Mario Caironi   +8 more
wiley   +1 more source

Identification of the Temperature Dependence of the Thermal Expansion Coefficient of Polymers. [PDF]

Polymers (Basel), 2021
Shardakov IN, Trufanov AN.
europepmc   +1 more source

Memristive‐Gated RC‐Delay Synaptic Transistors for Time‐Encoded Analog in‐Memory Computing

Advanced Functional Materials, EarlyView.
A Memristive‐Gated Transistor for Time‐Encoded Analog In‐Memory Computing — By exploiting the RC delay of a self‐rectifying interface‐type memristor, nonlinear I–V distortion is structurally bypassed, enabling 3‐bit nonvolatile memory, spike‐timing‐based analog encoding, and hardware‐calibrated reservoir‐computing validation within a unified device ...
Yun‐Seo Shin, Eunjoo Yoo, Ki‐Hoon Son, Hyun‐Sik Kim, Dae‐Hee Han, Jeong Hyeon Son, Seung Hwan Lee, Hong‐Sub Lee   +7 more
wiley   +1 more source

Carboxylated Carbon Nanotube/Polyimide Films with Low Thermal Expansion Coefficient and Excellent Mechanical Properties. [PDF]

Polymers (Basel), 2022
Lu C, Lin F, Shao H, Bi S, Chen N, Shao G, Jiang J.   +6 more
europepmc   +1 more source

Gradient‐Conductivity Architecture Enables Synchronous Enhancement of Sensitivity and Detection Range in Multifunctional All‐Paper Sensors

Advanced Functional Materials, EarlyView.
A gradient‐engineered all‐paper sensor is fabricated by integrating MXene and in situ grown AgNPs within hierarchical cellulose networks. The device breaks the sensitivity–detection range trade‐off through cascaded conductive pathways, enabling ultrahigh pressure sensitivity, humidity–pressure decoupled dual‐mode sensing, and outstanding EMI shielding,
Ao Li, Jun Xu, Dezhong Xu, Zhaohui Zhang, Jiyi Li, Daxian Cao, Kefu Chen, Mizi Fan   +7 more
wiley   +1 more source

The mechanical and thermal parameters of two-dimensional hexagonal materials evaluated using elastic properties: Monolayer MoS2 as an example

Results in Physics
The thermal expansion coefficient of two-dimensional (2D) materials is a very important physical parameter when forming heterostructures. Here, we have established a method that can be employed to evaluate the thermal expansion coefficient of 2D ...
Li Xue, Yiming Ren, Jun-Rong He, Yuan Zhao, Si-Liu Xu, Yonghong Hu, Chun-Bo Hua   +6 more
doaj   +1 more source

Calculation of Thermal Expansion Coefficient of Rare Earth Zirconate System at High Temperature by First Principles. [PDF]

Materials (Basel), 2022
Wang X, Bai X, Xiao W, Liu Y, Li X, Wang J, Peng C, Wang L, Wang X.   +8 more
europepmc   +1 more source

Emerging Post‐CMOS Hardware Neurons for Brain‐Inspired Computing: Devices, Circuits, and System Integration

Advanced Functional Materials, EarlyView.
The physical realization of artificial neurons is a critical challenge for energy‐efficient neuromorphic computing. This review presents a comprehensive analysis of the evolution of artificial neuron implementations from conventional CMOS to emerging post‐CMOS technologies.
Kannan Udaya Mohanan, Hocheon Yoo, Benoît H. Lessard, Ioannis Kymissis, Chang‐Hyun Kim   +4 more
wiley   +1 more source

Hydrocarbon Resin-Based Composites with Low Thermal Expansion Coefficient and Dielectric Loss for High-Frequency Copper Clad Laminates. [PDF]

Polymers (Basel), 2022
Dong J, Wang H, Zhang Q, Yang H, Cheng J, Xia Z.   +5 more
europepmc   +1 more source