Results 141 to 150 of about 869,423 (294)

Scalable Thermal Engineering via Femtosecond Laser‐Direct‐Written Phononic Nanostructures

open access: yesAdvanced Functional Materials, EarlyView.
This study demonstrates that femtosecond laser‐induced periodic surface structures (fs‐LIPSS) can function as phononic metasurfaces, reducing thermal conductivity below the plain thin‐film limit. Phonon Monte Carlo analysis reveals that the periodic structures restrict phonon mean free paths.
Hiroki Hamma   +4 more
wiley   +1 more source

Switchable Thermal Mid‐IR Conducting Polymer Antenna Arrays

open access: yesAdvanced Functional Materials, EarlyView.
This study presents switchable mid‐infrared plasmonic resonances in PEDOT antenna arrays. Their optical extinction peaks can be reversibly switched ‘OFF’ and ‘ON’ by tuning the polaronic charge carrier concentration via the polymer's redox state, offering modulation of optical responses in the thermal mid‐infrared range including around 10 µm ...
Pravallika Bandaru   +5 more
wiley   +1 more source

An Ultrafast Self‐Gelling Versatile Hydrogel for Rapid Infected Burn Wound Repair in Military Medicine

open access: yesAdvanced Functional Materials, EarlyView.
A self‐gelling PG@PAC (POD/Gel‐CDH@PA/CHX) powder is developed for infected burn care in austere settings. Upon contact with wound exudate, it instantly forms an adhesive hydrogel, providing simultaneous hemostasis, broad‐spectrum antibacterial activity, reactive oxygen species scavenging, and immunomodulation. In a murine model of S.
Liping Zhang   +14 more
wiley   +1 more source

A Framework for Thermal and Performance Management

open access: green, 2012
Davide B. Bartolini   +5 more
openalex   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

open access: yesAdvanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

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