Scalable Thermal Engineering via Femtosecond Laser‐Direct‐Written Phononic Nanostructures
This study demonstrates that femtosecond laser‐induced periodic surface structures (fs‐LIPSS) can function as phononic metasurfaces, reducing thermal conductivity below the plain thin‐film limit. Phonon Monte Carlo analysis reveals that the periodic structures restrict phonon mean free paths.
Hiroki Hamma +4 more
wiley +1 more source
Silicified Wood with Dual Fire Retardancy and Thermal Management Functionalities. [PDF]
Tu K, Liu J, Li J, Li S, Zhang X, Li S.
europepmc +1 more source
Switchable Thermal Mid‐IR Conducting Polymer Antenna Arrays
This study presents switchable mid‐infrared plasmonic resonances in PEDOT antenna arrays. Their optical extinction peaks can be reversibly switched ‘OFF’ and ‘ON’ by tuning the polaronic charge carrier concentration via the polymer's redox state, offering modulation of optical responses in the thermal mid‐infrared range including around 10 µm ...
Pravallika Bandaru +5 more
wiley +1 more source
Intrinsically Flexible Polyurethane-Based Phase-Change Composites with High Heat Storage Density for Thermal Management Applications. [PDF]
Liu J, Dong J, Shi W.
europepmc +1 more source
A self‐gelling PG@PAC (POD/Gel‐CDH@PA/CHX) powder is developed for infected burn care in austere settings. Upon contact with wound exudate, it instantly forms an adhesive hydrogel, providing simultaneous hemostasis, broad‐spectrum antibacterial activity, reactive oxygen species scavenging, and immunomodulation. In a murine model of S.
Liping Zhang +14 more
wiley +1 more source
Ultra-Light Poly(N-isopropylacrylamide) Hydrogels: Light Weight Water Materials for Passive Thermal Management via Insulation and Cooling. [PDF]
Hu X, Dou S, Liu Y, Li Y, Yu C, Wang J.
europepmc +1 more source
A Framework for Thermal and Performance Management
Davide B. Bartolini +5 more
openalex +1 more source
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
Thermal Management with AlN Passivation in AlGaN/GaN HEMTs with an Air Gap Gate for Improved RF Performance: A Simulation Study. [PDF]
Won YH +6 more
europepmc +1 more source

