Results 141 to 150 of about 3,748,225 (281)
A high interstital austenitic steel is additively manufactured and postdensified by HIP to eliminate gas porosity. Thereby, the loss of N and Mn in Ar HIP atmosphere is investigated. Further, HIP using N2 atmosphere is investigated which led to excessive nitride formation.
F. Großwendt +4 more
wiley +1 more source
Temporal and thermal optimization of trypsin digestion for the cryptococcal proteome. [PDF]
Sun J, McAlister JA, Geddes-McAlister J.
europepmc +1 more source
A Multi‐Scale Machine Learning Framework for the Inverse Design of High Entropy Alloys
High‐entropy alloys offer vast potential for various applications, including electrocatalysis; however, their compositional complexity challenges conventional screening. We introduce an inverse‐design framework combining two neural networks to determine optimal compositions and reconstruct nanoparticle geometry from targeted properties and conventional
Mikael Takoutsin +14 more
wiley +1 more source
Research on Intelligent Thermal Optimization for Chiplet-Based Heterogeneously Integrated AI Chip Embedded with Leaf-Vein-Inspired Fractal Microchannels. [PDF]
Wu J +8 more
europepmc +1 more source
PUF/ENB microcapsules were synthesized based on a sequential factorial design and incorporated into an epoxy matrix. Their anticorrosive action, associated with the self‐healing mechanism, demonstrated that the addition of microcapsules to the coating improved anticorrosive performance compared to pure epoxy coatings, particularly when the encapsulate ...
Vandicleya Alves Moreira +6 more
wiley +1 more source
Mitigating Jahn-Teller active Mn<sup>3+</sup> <i>via</i> thermal optimization in Li-rich layered oxides: a path toward enhanced capacity and cycling stability. [PDF]
Ramesh P, Therese HA.
europepmc +1 more source
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone +11 more
wiley +1 more source
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein +4 more
wiley +1 more source
Lumped Parameter Thermal Network Modeling and Thermal Optimization Design of an Aerial Camera. [PDF]
Fan Y, Feng W, Ren Z, Liu B, Wang D.
europepmc +1 more source
DNA strands are employed both as dynamic linkers and nanoscale templates for the integration of Ag2S nanoparticles on MoS2, which in turn imparted photothermal responsiveness; this feature permits the selective cargo (fluorophore, quantum dots or an enzyme) release from the MoS2 surface in response to local heat induced by light irradiation.
Kai Chen +3 more
wiley +1 more source

