Results 131 to 140 of about 6,644,988 (309)

Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface. [PDF]

Materials (Basel), 2023
Lee J, Jo W, Kwon JH, Griffin B, Cho BG, Landahl EC, Lee S.   +6 more
europepmc   +1 more source

An Experimental High‐Throughput Approach for the Screening of Hard Magnet Materials

Advanced Engineering Materials, EarlyView.
An entire workflow for the high‐throughput characterization and analysis of compositionally graded magnetic films is presented. Characterization protocols, data management tools and data analysis approaches are illustrated with test case Sm(Fe, V)12 based films.
William Rigaut, Pierre Le Berre, Hamdi Jaballah, Lukas Fink, Victor Poline, Richard Haettel, Stéphane Grenier, Gilbert Chahine, Ewen Bellec, Guillaume Buatier, Wilfried Hortschitz, Santa Pile, Thomas Schrefl, Nils Blanc, Yuan Hong, Thibaut Devillers, Nora M. Dempsey   +16 more
wiley   +1 more source

An approach for estimating thermoelectric module equivalent properties by thermal resistance and numerical modeling. [PDF]

iScience
Pham MQ, Nguyen VL, Vo TQ, Hong TD.
europepmc   +1 more source

Macroscopic negative differential thermal resistance in the overlapping graphene homojunction structure. [PDF]

iScience, 2023
Wu R, Tian H, Zhu Z, Liu Y, Xing CY, Zhang G, Ren TL.   +6 more
europepmc   +1 more source

Natural Bone‐Derived Ceramic Scaffolds Functionalized with Chitosan‐Gold, Chitosan‐Magnesium, and Chitosan‐Zinc for Enhanced Antibacterial Activity

Advanced Engineering Materials, EarlyView.
This study reports the development of antibacterial ceramic scaffolds derived from natural bovine bone. The bones were processed through sequential boiling and hydrogen peroxide treatment to remove organic matter, producing porous, mineral‐rich scaffolds.
Mohamad Hassan Taherian, Anh Thi Le, Anh Thi Van Le, Dung My Thi Dang, Tin Chanh Duc Doan, Chien Mau Dang, Martin Bolduc   +6 more
wiley   +1 more source

Optimization of Processing Parameters and Application Performance Evaluation of a High Thermal Conductivity, Low Thermal Resistance Gel. [PDF]

Gels
Xu Y, Hong D, Liu L, Wang W, Jiang M, Yang H, Chen T, Jia K.   +7 more
europepmc   +1 more source

Validation of a Skin Calorimeter to Determine the Heat Capacity and the Thermal Resistance of the Skin. [PDF]

Sensors (Basel), 2023
Rodríguez de Rivera PJ, Rodríguez de Rivera M, Socorro F, Rodríguez de Rivera M.   +3 more
europepmc   +1 more source

Molecular Dynamics Studies of Shape Memory Polymers: From Bead–Spring Models to Atomistic Simulations

Advanced Engineering Materials, EarlyView.
Coarse‐grained (left) and atomistic (right) models of the shape memory polymer ESTANE ETE 75DT3 are shown schematically. The two representations bridge molecular detail and mesoscopic description. Both models capture shape memory behavior, linking segmental mobility and conformational relaxation of anisotropic chains to macroscopic recovery, and ...
Fathollah Varnik
wiley   +1 more source

Strategy Construction to Improve the Thermal Resistance of Polyimide-Matrix Composites Based on Fiber-Resin Compatibility. [PDF]

Materials (Basel)
Xing Y, Ni H, Zhang D, Li J, Chen X.
europepmc   +1 more source

Comparative Transcriptome Analyses Provide New Insights into the Evolution of Divergent Thermal Resistance in Two Eel Gobies. [PDF]

Curr Issues Mol Biol, 2023
Liu J, Liu T, Liu Y, Wang Y, Liu L, Gong L, Liu B, Lü Z.   +7 more
europepmc   +1 more source