Results 201 to 210 of about 6,644,988 (309)

Nanoscale Imaging and Measurements of Grain Boundary Thermal Resistance in Ceramics with Scanning Thermal Wave Microscopy. [PDF]

ACS Appl Mater Interfaces
Alikin D, Pereira MJ, Abramov A, Pashnina E, Chuvakova M, Lavrik NV, Xie W, Weidenkaff A, Kholkin AL, Kovalevsky A, Tselev A.   +10 more
europepmc   +1 more source

Foundational Machine‐Learning Interatomic Potential for Simulating Chemically Complex Ni‐Based Superalloys

Advanced Engineering Materials, EarlyView.
We apply a foundational machine‐learning interatomic potential based on the graph atomic cluster expansion (GRACE) to simulate the commercial Ni‐based single‐crystal superalloy CMSX‐4. Hybrid Monte‐Carlo/molecular dynamics sampling resolves short‐range order in the γ phase and L12 sublattice occupancies in the γ’ phase and connects them to stacking ...
Aditya Vishwakarma, Sarath Menon, Fritz Körmann, Thomas Hammerschmidt, Ralf Drautz   +4 more
wiley   +1 more source

Enhancing the Thermal Resistance of UV-Curable Resin Using (3-Thiopropyl)polysilsesquioxane. [PDF]

Materials (Basel)
Pakuła D, Sztorch B, Topa-Skwarczyńska M, Gałuszka K, Ortyl J, Marciniec B, Przekop RE.   +6 more
europepmc   +1 more source

Stretching the Printability Metric in Direct‐Ink Writing with Highly Extensible Yield‐Stress Fluids

Advanced Functional Materials, EarlyView.
This study introduces “drawability” as a new metric for assessing printability in direct‐ink writing, focusing on gap‐spanning performance and speed robustness. By designing yield‐stress fluids with high extensibility, we demonstrate that extensional strain‐to‐break significantly enhances printability.
Chaimongkol Saengow, Samya Sen, Joaquin Yus, Eliza E. Lovrich, Amanda G. Hoika, Kelly M. Chang, Arielle A. Pfeil, Nellie Haug, Amy J. Wagoner Johnson, Randy H. Ewoldt   +9 more
wiley   +1 more source

Extremely Low Thermal Resistance of β-Ga₂O₃ MOSFETs by Co-integrated Design of Substrate Engineering and Device Packaging. [PDF]

ACS Appl Mater Interfaces
Qu Z, Xie Y, Zhao T, Xu W, He Y, Xu Y, Sun H, You T, Han G, Hao Y, Ou X.   +10 more
europepmc   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Molecular dynamics investigation on the interfacial thermal resistance between annealed pyrolytic graphite and copper. [PDF]

RSC Adv
Jiang X, Li X, Li D, Su L, Zhang T, Chen B, Li Z.   +6 more
europepmc   +1 more source

Influence of Water Activity on Thermal Resistance of Microorganisms in Low-Moisture Foods: A Review.

Comprehensive Reviews in Food Science and Food Safety, 2016
R. Syamaladevi, Juming Tang, Rossana Villa-Rojas, S. Sablani, B. Carter, G. Campbell   +5 more
semanticscholar   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source

Validation of a Simulated Commercial Plain Bagel Baking Process and Thermal Resistance Characterization of a 5-Strain Shiga Toxin-Producing <i>Escherichia coli</i> When Introduced via Flour. [PDF]

Foods
Hunt C, Singh A, Ramesh D, Channaiah LH.
europepmc   +1 more source