Results 111 to 120 of about 339,034 (247)
Binder‐free laser powder bed fusion of 8YSZ with a femtosecond laser is used to map process windows linking scan strategy, heat accumulation, and grain growth. Time‐resolved thermography and simulations reveal thermal regimes that enable continuous, vitrified, and fine‐grained 8YSZ surface layers without absorptive additives and demonstrate ...
Markus Kühn +5 more
wiley +1 more source
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
wiley +1 more source
Formation of nanoscale vapour films governing thermal resistance in amorphous ice. [PDF]
Liu Y +21 more
europepmc +1 more source
THERMAL RESISTIVITY AND THERMAL MAGNETORESISTIVITY OF POTASSIUM. [PDF]
Newrock, R.S., Maxfield, B.W.
openaire +2 more sources
Fabrication Routes for Ionic Conducting Fiber Strain Sensors
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw +3 more
wiley +1 more source
Visualizing interfacial thermal resistance in two-dimensional material-polymer composites from measurement to mechanistic understanding. [PDF]
Li Z +9 more
europepmc +1 more source
Measurement Methods of the Thermal Resistance of Materials Used in Clothing. [PDF]
Rogale D +4 more
europepmc +1 more source
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji +3 more
wiley +1 more source
An approach for estimating thermoelectric module equivalent properties by thermal resistance and numerical modeling. [PDF]
Pham MQ, Nguyen VL, Vo TQ, Hong TD.
europepmc +1 more source
Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface. [PDF]
Lee J +6 more
europepmc +1 more source

