Results 151 to 160 of about 339,034 (247)

Rotary 3D Printing With Integrated Electroplating

Advanced Engineering Materials, EarlyView.
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria, Nicola Larovere, Moslem Mohammadi, Gianluca Percoco, Ali Zolfagharian, Gianni Stano   +5 more
wiley   +1 more source

Solution-sheared supramolecular oligomers with enhanced thermal resistance in interfacial adhesion and bulk cohesion. [PDF]

Nat Commun
Lu G, Ma R, Zhao Y, Wang D, Shang W, Chen H, Khan SA, Li M, Saiz E.   +8 more
europepmc   +1 more source

Airport Cement Concrete with Ceramic Dust of Increased Thermal Resistance. [PDF]

Materials (Basel), 2022
Linek M.
europepmc   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Predicting Thermal Resistance of Packaging Design by Machine Learning Models. [PDF]

Micromachines (Basel)
Lai JP, Lin S, Lin V, Kang A, Wang YP, Pai PF.   +5 more
europepmc   +1 more source

In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging. [PDF]

ACS Appl Electron Mater, 2022
Poopakdee N, Abdallah Z, Pomeroy JW, Kuball M.   +3 more
europepmc   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source

Measurement of interfacial thermal resistance in high-energy-density matter. [PDF]

Nat Commun
Allen CH, Oliver M, Gericke DO, Brouwer N, Divol L, Kemp GE, Landen OL, Morrison L, Ping Y, Schölmerich MO, Shaffer N, Spindloe C, Sterne PA, Theobald WR, Döppner T, White TG.   +15 more
europepmc   +1 more source

DNA‐Templated 2D Heterostructures as Phototriggered Dynamic Nanohybrids: From Releasing Molecular Loads to Controlling Enzyme Biocatalytic Function

Advanced Functional Materials, EarlyView.
DNA strands are employed both as dynamic linkers and nanoscale templates for the integration of Ag2S nanoparticles on MoS2, which in turn imparted photothermal responsiveness; this feature permits the selective cargo (fluorophore, quantum dots or an enzyme) release from the MoS2 surface in response to local heat induced by light irradiation.
Kai Chen, Haosen Miao, Weiying Hong, Matteo Palma   +3 more
wiley   +1 more source

Assessment of Thermal Resistance of Hot Water in Pasteurization. [PDF]

ACS Omega
Alhusni HA, Ramamurthy T, Krishnan S.
europepmc   +1 more source