Results 281 to 290 of about 6,644,988 (309)
Some of the next articles are maybe not open access.
Study on the Method to Measure the Junction-to-Case Thermal Resistance of Press-Pack IGBTs
IEEE transactions on power electronics, 2018E. Deng +4 more
semanticscholar +1 more source
Online Calculation of the Increase in Thermal Resistance Caused by Solder Fatigue for IGBT Modules
IEEE transactions on device and materials reliability, 2017Zhen Hu, Mingxing Du, Kexin Wei
semanticscholar +1 more source

