Formation of nanoscale vapour films governing thermal resistance in amorphous ice. [PDF]
Liu Y +21 more
europepmc +1 more source
The reliability of thermal interface materials (TIM1) in lidded high-power flip-chip packages is investigated using a thermal test vehicle (TTV) under active power cycling.
Sternberg, Maik +5 more
core +1 more source
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
wiley +1 more source
Visualizing interfacial thermal resistance in two-dimensional material-polymer composites from measurement to mechanistic understanding. [PDF]
Li Z +9 more
europepmc +1 more source
Measurement Methods of the Thermal Resistance of Materials Used in Clothing. [PDF]
Rogale D +4 more
europepmc +1 more source
Fabrication Routes for Ionic Conducting Fiber Strain Sensors
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw +3 more
wiley +1 more source
An approach for estimating thermoelectric module equivalent properties by thermal resistance and numerical modeling. [PDF]
Pham MQ, Nguyen VL, Vo TQ, Hong TD.
europepmc +1 more source
Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface. [PDF]
Lee J +6 more
europepmc +1 more source
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji +3 more
wiley +1 more source
In-plane thermal transport and interfacial thermal resistance in carbon/silicon carbide van der Waals heteronanotubes: a molecular dynamics study. [PDF]
Dhrubo DS, Islam ASMJ, Mia I.
europepmc +1 more source

