Results 131 to 140 of about 338,421 (267)

A thermal resistance prediction model for heterogeneous integrated chips incorporating an AI-based BP neural network. [PDF]

Sci Rep
Li Y, Xu S, Guo L.
europepmc   +1 more source

Thermal-Resistance Effect of Graphene at High Temperatures in Nanoelectromechanical Temperature Sensors. [PDF]

Micromachines (Basel), 2022
Lei S, Su N, Li M.
europepmc   +1 more source

Materials‐Driven Additive Manufacturing for Electrical Machines: Qualification‐Oriented Design Beyond Geometric Freedom

Advanced Engineering Materials, EarlyView.
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley   +1 more source

Fast Thermal Resistance Distribution Analysis in High-Power VCSEL Array Module. [PDF]

Materials (Basel)
Li D, Lan T, Wang Z, Ye Z.
europepmc   +1 more source

Dynamic Thermal Treatments in Green Coconut Water Induce Dynamic Stress Adaptation of Listeria innocua That Increases Its Thermal Resistance. [PDF]

Foods, 2023
González-Tejedor GA, Garre A, Iguaz A, Wong-Zhang R, Fernández PS, Possas A.   +5 more
europepmc   +1 more source

Effects of Mg on Microstructure and Solidification of a Hypereutectic Zn–8 wt.%Al Alloy

Advanced Engineering Materials, EarlyView.
An appreciable set of results involving thermal data, microstructure, chemical composition, and microstructural growth laws is reported for ZnAlMg alloys. Such results demonstrate that ZnAlMg alloys have high potential for applications in automotive self‐lubricating components, batteries, and electrical systems.
Raí B. de Sousa, Jeverton L. Paixão, Daylla S. Silva, Bruno S. Sobral, Mucio D. de Medeiros, José E. Spinelli, Bismarck L. Silva   +6 more
wiley   +1 more source

Assessment of the Effect of Phosphorus in the Structure of Epoxy Resin Synthesized from Natural Phenol-Eugenol on Thermal Resistance. [PDF]

Int J Mol Sci
Matykiewicz D, Dudziec B, Piasecki A.
europepmc   +1 more source

Laser Thermal Wave Diagnostics of the Thermal Resistance of Soldered and Bonded Joints in Semiconductor Structures. [PDF]

Sensors (Basel), 2023
Glazov A, Muratikov K.
europepmc   +1 more source

Supporting AI Readiness Through Digital Workflows in Materials Science

Advanced Engineering Materials, EarlyView.
Digitalization drives innovation in materials science by connecting data silos and turning heterogeneous processes into reusable research pipelines. Across 13 MaterialDigital projects, digital workflows reveal complementary pathways toward AI‐ready materials research, founded on structured data, persistent artifacts, executable orchestration, and ...
Marian Bruns, Lateef Abdul, Stephan Barth, Martin Glauer, Manuel Günther, Fabian Neuhaus, Jan‐Ole Perschewski, Thomas Bjarsch, Henrik Abel, Johannes Bosch, Niklas Meyer, Peter Hofmann, Marc Drechsler, Alexander Dyck, Dhanunjaya Kumar Nerella, Marvin Tegeler, Oleg Shchyglo, Ingo Steinbach, Timo Klecker, Henk Birkholz, Ehsan Borzabadi Farahani, Bernard Fedelich, Cetin Haftaoglu, Tarakeshwar Lakshmipathy, Elena Garcia Trelles, Christoph Schweizer, Reza Darvishi Kamachali, Lukas Koschmieder, Janin Eiken, Markus Apel, Sung‐Min Wi, Jiangdong Zhao, Andreas Fezer, Nicolas Christ, Patrick Schneider, Eldor Urinov, Veit Königer, Volker Knoblauch, Janik Harter, Thomas Seifert, Thitichai Janpheng, Florian Fuchs, Fabian Teichert, Jörg Schuster, Anke Bardehle, Andreas Limper, Ulrich Giese, Carlos Lucke, Mario Beiner, Christoph Gögelein, Lisa Leuchtenberger‐Engel, Christian Hopmann, Felix Wentzien, Heike Wittek, Benjamin Klie, Alexander Röhrs, Ludger Overmeyer, Achraf Atila, Marcel Sadowski, Leopold Talirz, Jan Janssen, Jesper R. Pedersen, Peter Beck, Tejs Vegge, Ivano E. Castelli, Wolfgang Wenzel, Tilmann Hickel, Jörg Schaarschmidt   +67 more
wiley   +1 more source

Author Correction: Solution-sheared supramolecular oligomers with enhanced thermal resistance in interfacial adhesion and bulk cohesion. [PDF]

Nat Commun
Lu G, Ma R, Zhao Y, Wang D, Shang W, Chen H, Khan SA, Li M, Saiz E.   +8 more
europepmc   +1 more source