Results 201 to 210 of about 4,567,939 (306)

Solution-sheared supramolecular oligomers with enhanced thermal resistance in interfacial adhesion and bulk cohesion. [PDF]

Nat Commun
Lu G, Ma R, Zhao Y, Wang D, Shang W, Chen H, Khan SA, Li M, Saiz E.   +8 more
europepmc   +1 more source

Effects of Calcium and pH on Rheological Thermal Resistance of Composite Xanthan Gum and High-Methoxyl Apple Pectin Matrices Featuring Dysphagia-Friendly Consistency. [PDF]

Foods, 2023
Yang H, Chou LY, Hua CC.
europepmc   +1 more source

DNA‐Templated 2D Heterostructures as Phototriggered Dynamic Nanohybrids: From Releasing Molecular Loads to Controlling Enzyme Biocatalytic Function

Advanced Functional Materials, EarlyView.
DNA strands are employed both as dynamic linkers and nanoscale templates for the integration of Ag2S nanoparticles on MoS2, which in turn imparted photothermal responsiveness; this feature permits the selective cargo (fluorophore, quantum dots or an enzyme) release from the MoS2 surface in response to local heat induced by light irradiation.
Kai Chen, Haosen Miao, Weiying Hong, Matteo Palma   +3 more
wiley   +1 more source

Predicting Thermal Resistance of Packaging Design by Machine Learning Models. [PDF]

Micromachines (Basel)
Lai JP, Lin S, Lin V, Kang A, Wang YP, Pai PF.   +5 more
europepmc   +1 more source

In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging. [PDF]

ACS Appl Electron Mater, 2022
Poopakdee N, Abdallah Z, Pomeroy JW, Kuball M.   +3 more
europepmc   +1 more source

Counterion Dependent Side‐Chain Relaxation Stiffens a Chemically Doped Thienothiophene Copolymer

Advanced Functional Materials, EarlyView.
Oxidation of a thienothiophene copolymer, p(g3TT‐T2), via different doping strategies and dopant molecules resulted in materials with similar oxidation levels and a high electrical conductivity of ≈100 S cm−1. However, mechanical properties varied significantly, with sub‐glass transition temperatures and elastic moduli spanning from –44°C to –3°C and ...
Mariavittoria Craighero, Meghna Jha, Elsa Veronica Flores‐Vela, Joost Kimpel, Andreas Schaefer, Jiali Guo, Jesika Asatryan, Alberto Peinador Veiga, Shuichi Haraguchi, Per‐Anders Carlsson, Jaime Martín, Mariano Campoy‐Quiles, Christian Müller   +12 more
wiley   +1 more source

Measurement of interfacial thermal resistance in high-energy-density matter. [PDF]

Nat Commun
Allen CH, Oliver M, Gericke DO, Brouwer N, Divol L, Kemp GE, Landen OL, Morrison L, Ping Y, Schölmerich MO, Shaffer N, Spindloe C, Sterne PA, Theobald WR, Döppner T, White TG.   +15 more
europepmc   +1 more source

From Food to Power: Hydrogel Thermoelectrics for Ingestible Electronics

Advanced Functional Materials, EarlyView.
We introduce a fully edible thermoelectric–electrochromic platform that harvests heat from food and converts it into a visible color change. N‐type and p‐type hydrogel thermoelectric generators connected in series power anthocyanin‐based electrochromic displays, demonstrating the feasibility of safe, biodegradable, ingestible systems for on‐food ...
Antonia Georgopoulou, Bokeon Kwak, Dario Floreano, Esther Amstad   +3 more
wiley   +1 more source

Assessment of Thermal Resistance of Hot Water in Pasteurization. [PDF]

ACS Omega
Alhusni HA, Ramamurthy T, Krishnan S.
europepmc   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

Advanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa, Milan Buttberg, Ke Ran, Rana Walied Ahmad, Dennis Braun, Lukas Völkel, Jimin Lee, Sofía Cruces, Bart Macco, Bárbara Canto, Holger Lerch, Thorsten Wahlbrink, Holger Kalisch, Michael Heuken, Andrei Vescan, Joachim Mayer, Zhenxing Wang, Ilia Valov, Stephan Menzel, Max C. Lemme   +19 more
wiley   +1 more source