Selective Interfacial Barriers Drive High‐Performance GeTe Thermoelectrics
Carrier‐phonon decoupling is the key to developing high‐performance thermoelectric materials. Here, we demonstrate that selective interfacial barriers can decouple carrier and phonon transport, thus achieving an exceptional peak ZT of ∼2.7 at 773 K, along with a record‐high average ZT of 1.9 across 300–773 K in the (Ge0.82Mn0.04Bi0.04Pb0.1Te)0.99(VSe2 ...
Liang‐Cao Yin +12 more
wiley +1 more source
Large scale graphene thermoelectric device with high power factor using gradient doping profile
Hyeon Jun Hwang +3 more
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Indium substitution in Ag2Se nanocrystals simultaneously tailors electronic structure and lattice dynamics. Fermi‐level upshift and band‐gap narrowing enhance electrical transport, while defect‐induced lattice softening intensifies phonon scattering and suppresses lattice thermal conductivity.
Yineng Gou +11 more
wiley +1 more source
Shooting Three Birds with One Stone: Device Construction and Thermal Management for Simultaneous Photothermal Conversion Water Evaporation, Thermoelectric Generation and Photocatalytic Degradation [PDF]
Haiwen Wang +8 more
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A type of thermoelectric ionogels with convertible n‐p thermopowers are demonstrated with Seebeck coefficients ranging from ‐3.61 to +9.74 mV K−1. Thus, thermoelectric gating organic electrochemical transistor is achieved by employing ionogel as thermoelectric modules and ionic dielectrics simultaneously, paving the road to self‐powered, highly ...
Xingyu Hu +8 more
wiley +1 more source
Thermoelectric device for active thermal concealment, deception and messaging. [PDF]
Hou Y +10 more
europepmc +1 more source
Investigation of LaAlO3 pervoskite compound for optoelectronic and thermoelectric devices under pressure [PDF]
Muhammad Yaseen +10 more
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Progress in Strain Engineering of 2D‐Integrated Heterostructures for Ultrasensitive Sensors
. ABSTRACT Two‐dimensional (2D) integrated heterostructures have emerged as a cornerstone in the advancement of next‐generation sensor technologies. These heterostructures, which combine materials with different dimensionalities, have led to significant breakthroughs in sensing performance and device integration.
That Buu Ton +4 more
wiley +1 more source
Analysis of P-Type Bi2Te3 Thermoelectric Cooler Device Performance Using Embedded model
G. Udhaya Sankar, C. Ganesa Moorthy
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