Results 71 to 80 of about 4,435,043 (396)
Thermoelectric devices that are flexible and optically transparent hold unique promise for future electronics. However, development of invisible thermoelectric elements is hindered by the lack of p-type transparent thermoelectric materials.
Chang Yang+10 more
semanticscholar +1 more source
This study demonstrates a novel, additive manufacturing approach to produce complex, porous tungsten carbide structures using water‐based direct ink writing/robocasting. Leveraging a modified commercial printer and heat treatment, the process yields lightweight, electrically conductive 3D architectures capable of supporting a mechanical load.
James Bentley Bevis+3 more
wiley +1 more source
Phase diagrams of transition‐metal di‐pnictides have been efficiently and quickly explored by combinatorial deposition of transition‐metal films and subsequent antimonization enabling the study of compounds with volatile elements. In (Fe,Ni)Sb2 and the (Fe,Cr)Sb2 substitution series, phase separation has been evidenced between class‐A and B marcasites ...
Martin Kostka+8 more
wiley +1 more source
The share of technical thermoplastics is expected to grow further in the e‐mobility segment. In this study, a detailed temperature‐based tribological characterization of technical thermoplastics is performed. The tribological properties are discussed in terms of the dynamic mechanical properties of polymers at different ambient temperatures. A proof of
Harsha Raghuram+2 more
wiley +1 more source
Sputter deposition of porous thin films from metal/NaCl powder targets [PDF]
A method to deposit porous thin films is elucidated. For this purpose, NaCl powder was mixed with a metal powder, cold pressed, and used as a target material in order to deposit a metal/NaCl thin film by DC magnetron sputtering.
Dedoncker, Robin+2 more
core +1 more source
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay+3 more
wiley +1 more source
Ohmic Contact of Cu/Mo and Cu/Ti Thin Layers on Multi-Crystalline Silicon Substrates [PDF]
Cu-Mo and Cu-Ti contact structures were fabricated on multi-crystalline silicon substrates to provide a low resistance ohmic contact. Deposition steps are done in an excellent vacuum chamber by means of electron beam evaporation and samples are then ...
Fatemeh Dehghan Nayeri+5 more
doaj
A new experimental setup, incorporating digital image correlation and infrared thermography in combination with inductive‐conductive heating for precise temperature control, is used to analyze the mechanical behavior and microstructural changes of sheet metal under complex thermomechanical test conditions that represent quench and partitioning ...
Christian Illgen+4 more
wiley +1 more source
Accurate measurement of the piezoelectric coefficient of thin films by eliminating the substrate bending effect using spatial scanning laser vibrometry [PDF]
One of the major difficulties in measuring the piezoelectric coefficient d(33,f) for thin films is the elimination of the contribution from substrate bending.
Huang, Zhaorong, Leighton, Glenn J. T.
core +1 more source
A thin-film magnetoresistive angle detector [PDF]
An overview is given of the results of our research on a contactless angle detector based on the anisotropic magnetoresistance effect (AMR effect) in a permalloy thin film.
Eijkel, Kees J.M.+5 more
core +2 more sources