Results 201 to 210 of about 31,417 (302)
Longitudinal associations between problematic TikTok use and academic performance among Chinese college students: mediation by academic burnout and disordered eating. [PDF]
Yan X, Wang S.
europepmc +1 more source
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
wiley +1 more source
The relationship between body mass index and types of peer bullying in primary school students: rising risk in cyberbullying. [PDF]
Büyükşahin Y, Biçim EN.
europepmc +1 more source
Fabrication Routes for Ionic Conducting Fiber Strain Sensors
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw +3 more
wiley +1 more source
Disordered Eating and Exercise Addiction Among Former Student-Athletes: Contribution of Athletic Experience and Personality. [PDF]
Maurin J, Boudreault V, Laverdière O.
europepmc +1 more source
Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley +1 more source
Growth Outcomes After 48 Weeks of Dolutegravir in Children and Adolescents With HIV-1 in IMPAACT P1093 and IMPAACT 2019. [PDF]
McKenna M +11 more
europepmc +1 more source
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source

