Results 241 to 250 of about 1,402,468 (402)
The Microstructural Evolution, Tensile Properties, and Phase Hardness of a TiAl Alloy with a High Content of the β Phase. [PDF]
Materials (Basel), 2019 Cui N, Wu Q, Yan Z, Zhou H, Wang X.
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Materials Selection Principles for Designing Electro‐Thermal Neurons
Advanced Electronic Materials, EarlyView.Materials property – performance relations are established for new and old electrical materials leveraged as electro‐thermal oscillators emulating neuron dynamics. Robust, reconfigurable, high frequency, low power characteristics are explicitly tied to highly nonlinear electrical transport, small specific heat, and greater electrical than thermal ...
Fatme Jardali +6 more
wiley +1 more source
Simulation and Experimental Study on Stress Relaxation Response of Polycrystalline γ-TiAl Alloy under Nanoindentation Based on Molecular Dynamics. [PDF]
Micromachines (Basel)Li J +5 more
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The Directional Solidification, Microstructural Characterization and Deformation Behavior of β-Solidifying TiAl Alloy. [PDF]
Materials (Basel), 2019 Cui N, Wu Q, Wang J, Lv B, Kong F.
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Advanced Electronic Materials, EarlyView.Negative differential resistance (NDR) is a key electronic response enabling two‐terminal artificial neurons. Interactions between electro‐thermal localizations and metal–insulator transitions (MITs) are investigated in a 3D multiphysics simulation of a lateral device. These findings demonstrate that the MIT nucleates in regions of high current density,
Adelaide Bradicich +6 more
wiley +1 more source
Advanced Electronic Materials, EarlyView.This study reveals a novel failure mode in SiO₂/Si₃N₄ stacked capacitors, where dopant diffusion leads to interfacial oxide thinning, reducing dielectric breakdown voltage. Experimental results show that n type capacitors exhibit superior reliability, whereas p type capacitors fail rapidly.
Shuo Wang +7 more
wiley +1 more source
Effect of Multi-Directional Forging on the Microstructure and Mechanical Properties of β-Solidifying TiAl Alloy. [PDF]
Materials (Basel), 2019 Cui N, Wu Q, Bi K, Wang J, Xu T, Kong F.
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