Results 241 to 250 of about 56,271 (309)
Laser shock processingcombination with Hf ion implantation results in dual modification on the surface of GH202 nickel‐based superalloy, which induces a large number of crystal defects, providing channels for the diffusion of metal cations. Hf ion implantation forms an amorphous HfO2 layer.
Jiangdong Cao +7 more
wiley +1 more source
Quantum‐confined lepidocrocite titanate nanofilaments are doped, bottom‐up, with Mn+2, Fe+2, Co+2, Ni+2, and Cu+2 to tune electronic structure and catalysis. Doping narrows the bandgap—by up to ∼0.8 eV—and extends visible absorption. Ni‐doped filaments accelerate oxygen evolution (319 mV at 10 mA cm−2) and TM‐doped samples rapidly degrade rhodamine 6G (
Mohamed A. Ibrahim +6 more
wiley +1 more source
It's all in the mix! By employing different homogenization strategies for preparing polystyrene/TiO2 polymer‐ceramic composite (PCC) powders, we tune the morphology of PCC films obtained by powder aerosol deposition, ranging from segregated multilayer‐like to finely blended composites.
Marc C. Thiel +5 more
wiley +1 more source
Multilayered Titanium Carbide MXene Film for Guided Bone Regeneration. [PDF]
Zhang J, Fu Y, Mo A.
europepmc +1 more source
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya +2 more
wiley +1 more source
Additive manufacturing revolutionizes production by enabling on‐demand, customized, and sustainable manufacturing with streamlined supply chains. While metal and polymer AM are well‐established, advanced ceramic AM is rapidly emerging, overcoming traditional material challenges.
Kateryna Oleksandrivna Shvydyuk +2 more
wiley +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
The patch mimics the dual physicochemical adhesion mechanisms of gecko toe micropillars and spider silk proteins, enabling strong interfacial bonding via partially cured micropillars. Its facile fabrication allows customization for precision medicine, while its motion responsiveness offers potential for real‐time wound monitoring.
Chengxin Luan +4 more
wiley +1 more source
Properties and composition of titanium carbide-niobium carbide cemented carbides
openaire +1 more source
A Review on Microreactor Design for Effective Fischer–Tropsch Process Intensification
Design strategies for effective Fischer–Tropsch process intensification are summarized based on experimental and simulation experiences. Recommendations for catalyst loading of packed‐bed and wash‐coated microchannel, microtube, micromonolith, and microstructured reactors are discussed.
Yangjun Wei +5 more
wiley +1 more source

