Results 51 to 60 of about 50,286 (201)

Transmission-line pulse testing software design [PDF]

open access: yes, 2016
Transmission-line pulse testing (TLP) and very fast transmission-line pulse testing (VF-TLP) are used to study the high current behaviors of integrated circuits and semiconductor devices, to characterize device response to electrostatic-discharge (ESD ...
Pace, Molly
core  

Thaumatin‐Like Proteins in Molecular Allergy Diagnostics: Uncommon, Co‐Sensitized, and Clinically Inconspicuous? Insights From an Italian Cohort

open access: yesAllergy, EarlyView.
This study assessed the prevalence, quantitative IgE levels, co‐sensitization patterns, and clinical significance of IgE reactivity to two TLPs—Act d 2 (kiwi) and Mal d 2 (apple)—in a large Italian allergic cohort. Thaumatin‐like protein (TLP) sensitization was uncommon (1.9%) and usually clinically silent when isolated.
Enrico Scala   +8 more
wiley   +1 more source

Stability of the Modified Euler Method for Nonlinear Dynamic Analysis of TLP

open access: yesInternational Journal of Maritime Technology, 2013
Efficiency of numerical methods is an important problem in dynamic nonlinear analyses. It is possible to use of numerical methods such as beta-Newmark in order to investigate the structural response behavior of the dynamic systems under random sea wave ...
Mohammadreza tabeshpour   +2 more
doaj  

Impacts of dietary different levels of thyme leave powder as a natural growth promoter on growth performance, carcass characteristics, and blood indices of broilers

open access: yesPoultry Science
: The objective of the present study was to ascertain the influence of thyme leaf powder (TLP) on growth rate, carcass features, and blood indicators in broiler diets as a natural antioxidant and antibiotic substitute.
Salma E. Deeb   +7 more
doaj   +1 more source

Microstructural Evolution of the TLP Joints of RAFM Steel during Aging and Creep

open access: yesMetals, 2022
In this study, transient liquid-phase (TLP) bonding was adopted to obtain a reliable reduced-activation ferritic/martensitic (RAFM) steel joint with Fe-Si-B amorphous foil.
Kun Liu   +3 more
doaj   +1 more source

The Unity of a Tractarian Fact [PDF]

open access: yes, 2007
It is not immediately clear from Wittgenstein’s Tractatus how to connect his idea there of an object with the logical ontologies of Frege and Russell. Toward clarification on this matter, this paper compares Russell’s and Wittgenstein’s versions of the ...
Johnston, Colin
core   +1 more source

EvolvED: Evolutionary Embeddings to Understand the Generation Process of Diffusion Models

open access: yesComputer Graphics Forum, EarlyView.
EvolvED visualises how diffusion models generate images by embedding intermediate outputs to preserve semantics and evolutionary structure. It supports analysis via (a) user‐defined goals and prompts, (b) sampling intermediate images, (c) extracting relevant features, and (d) visualising them in structured radial and rectilinear layouts for ...
Vidya Prasad   +5 more
wiley   +1 more source

Ethics and the activity of philosophy in early Wittgenstein [PDF]

open access: yes, 2018
Wittgenstein’s early work is well known for its seminal importance to the philosophy of language and logic during the second half of the 20th century and beyond.
Marks, Owen Chandler
core  

Engineering Marker‐Free Lettuce Chloroplast Genome to Express Functional Glucagon‐Like Peptide‐1 Receptor Agonists Exenatide and Lixisenatide

open access: yesPlant Biotechnology Journal, EarlyView.
Engineering of marker‐free lettuce chloroplast genome to express CTB‐Exenatide and CTB‐Lixisenatide for oral delivery. Upper panel: Chemically synthesised exenatide or lixisenatide require expensive production, purification, refrigeration and invasive delivery methods.
Rahul Singh, Henry Daniell
wiley   +1 more source

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

open access: yesMetals, 2020
Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials ...
Hyejun Kang   +2 more
doaj   +1 more source

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