Results 151 to 160 of about 98,138 (268)

Polo‐Like Kinase 1 Phosphorylation Tunes the Functional Viscoelastic Properties of the Centrosome Scaffold

open access: yesAdvanced Science, EarlyView.
To enable mitotic spindle assembly during cell division, centrosomes must bear tensile stresses generated by microtubule‐mediated pulling forces. Micro‐rheology reveals that PLK‐1 phosphorylation of the scaffold protein SPD‐5 tunes the viscoelasticity, size, and morphology of the centrosome scaffold in C. elegans.
Matthew Amato   +5 more
wiley   +1 more source

Bio-Inspired Approaches-A Leverage for Robotics. [PDF]

open access: yesBiomimetics (Basel)
Venkateswaran S   +3 more
europepmc   +1 more source

PACS‐2 Mitigates NPSC Apoptosis and Intervertebral Disc Degeneration by Preserving MAM Integrity via the SP1/LRRK2/Mfn2 Axis

open access: yesAdvanced Science, EarlyView.
This study investigates the role of PACS‐2 in IDD, demonstrating that it suppresses the nuclear translocation of SP1, thereby downregulating its downstream target LRRK2. This reduces LRRK2‐mediated ubiquitination and degradation of Mfn2 through the JNK pathway, preserving MAM integrity and promoting NPSC survival.
Liang Kang   +19 more
wiley   +1 more source

All‐In‐One Iontronic Sensing Aligner for High‐Precision 3D Orthodontic Force Monitoring

open access: yesAdvanced Science, EarlyView.
A wireless, battery‐free orthodontic sensing system is developed by integrating a cross‐shaped iontronic sensor and an origami‐inspired NFC circuit into clear aligners. This all‐in‐one device enables real‐time, in vivo 3D force monitoring with high precision and long‐term stability, providing clinicians with quantitative biomechanical feedback to ...
Jiahao Guo   +10 more
wiley   +1 more source

Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding

open access: yesAdvanced Science, EarlyView.
Hybrid bonding demands planarization of Cu/polymer interfaces, but soft polymers like benzocyclobutene (BCB) are difficult to polish by conventional chemical mechanical polishing (CMP). It is demonstrated that Ar plasma modification transforms BCB into a CMP‐compatible surface, enabling effective planarization and void‐free bonding.
Sukkyung Kang   +5 more
wiley   +1 more source

Home - About - Disclaimer - Privacy