Results 121 to 130 of about 3,168,491 (292)

Spinodal Decomposition in (Ti, Zr)(C, N) Ceramics: Data-Driven Efficient Design and Hardness-Toughness Synergy

open access: yesGaoya wuli xuebao
Traditional transition-metal carbide and nitride ceramics often exhibit a trade-off between hardness and toughness, leading to significantly reduced service life under severe conditions such as wear, corrosion, and high temperature.
Zhixuan ZHANG   +5 more
doaj   +1 more source

TRADITIONAL CERAMICS IN TECHNOLOGY EDUCATION [PDF]

open access: yesJournal of Technology and Information, 2010
Igor ŠTUBŇA   +2 more
openaire   +1 more source

Microscale Mapping of Fiber Strain and Damage in Composite Wrinkled Laminates Using Computed Tomography Assisted Wide‐Angle X‐Ray Scattering

open access: yesAdvanced Science, EarlyView.
This study combines full‐field tomography with diffraction mapping to quantify radial (ε002$\varepsilon _{002}$) and axial (ε100$\varepsilon _{100}$) lattice strain in wrinkled carbon‐fiber specimens for the first time. Radial microstrain gradients (−14.5 µεMPa$\varepsilon \mathrm{MPa}$−1) are found to signal damage‐prone zones ahead of failure, which ...
Hoang Minh Luong   +7 more
wiley   +1 more source

Early Islamic ceramics and glazes of Akhsiket, Uzbekistan [PDF]

open access: yes, 2010
The thesis examines the technical aspects of ceramics and glazes from Akhsiket, a regional capital in the early Islamic period, which was abandoned in the early 13th century.
Henshaw, C.M.
core  

Magnetoelectric Nanoparticle‐Based Wireless Brain–Computer Interface: Underlying Physics and Projected Technology Pathway

open access: yesAdvanced Science, EarlyView.
Magnetoelectric nanoparticles (MENPs) enable fully wireless, minutely invasive neuromodulation, and potentially neural recording, by converting magnetic into electric and, conversely, electric into magnetic fields, respectively, at high spatiotemporal resolution.
Elric Zhang   +14 more
wiley   +1 more source

Glass‐Ceramic Substrates for Electronics Packaging

open access: yesAdvanced Electronic Materials
The rapid advancement of wireless communication technologies, from 5G to 6G, has necessitated significant improvements in materials used for electronic packaging.
Adam Shearer   +4 more
doaj   +1 more source

Flexoelectricity in Photoconversion: Fundamentals, Materials, and Outlooks

open access: yesAdvanced Science, EarlyView.
Mechanical bending of a flexible cantilever induces a strain gradient in the photoactive material. The resulting flexoelectric field couples with photovoltaic and photoconductive effects, modulating charge generation, separation, and collection. A comparative analysis of oxide perovskites, halide perovskites, and two‐dimensional materials is presented,
Xiang Huang, Feng Li, Rongkun Zheng
wiley   +1 more source

Studies on ceramics [PDF]

open access: yes, 1984
The Ceramics Seminar, held in Jakarta from 3- 7 September 1979 was the first of its kind in Indonesia. It was attended by specialists from Indonesian Institutes, the Ceramic Society and by scholars from abroad.
Soejono, R.P.
core  

Neuromorphic Near‐Sensor and In‐Sensor Computing Enabled by Next‐Generation Material‐Based Sensors

open access: yesAdvanced Science, EarlyView.
This Review presents a structural framework that classifies neuromorphic sensing into near‐sensor and in‐sensor architectures, clarifying physical coupling between sensing and computation. The framework connects neural and synaptic device functions with recent advances in optical, mechanical, and chemical sensing, compares energy consumption and ...
Su Yeon Jung   +7 more
wiley   +1 more source

Interpretable Machine Learning Framework for Nb─Si Based Alloy Design with Enhanced Fracture Toughness

open access: yesAdvanced Science, EarlyView.
An interpretable machine learning framework integrating SHAP and PDP analysis identifies critical design descriptors from 139 physicochemical features for Nb─Si alloys. The framework achieves <7% prediction error and guides the discovery of Nb38.5Ti38.5Si3Zr18V2 alloy with 22.791 MPa·m1/2 fracture toughness, breaking the 20 MPa·m1/2 barrier.
Dezhi Chen   +7 more
wiley   +1 more source

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