Results 201 to 210 of about 138,874 (330)

Minuscule Amounts of Pt Single Atoms Selectively Loaded on Minor (101) Facet of Anatase Crystallites Enables Outstanding Utilization Efficiency for Photocatalytic H2 Production

open access: yesAdvanced Functional Materials, EarlyView.
Ar–H2 annealing triggers redistribution of pre‐deposited Pt single atoms (SAs) on faceted anatase nanosheets, with selective SAs accumulation on the minor (101) facetsthus the co‐catalytic SA‐sites are positioned only where they are needed, i.e. at the electron exit facets.
Shanshan Qin   +6 more
wiley   +1 more source

The Role of Fluorine‐Functionalized Organic Spacers for Defect Passivation and Low‐Dimensional Phase Formation in 3D MAPI Perovskite Solar Cells

open access: yesAdvanced Functional Materials, EarlyView.
Fluorine‐functionalized organic spacers (2F, 3F, 5F) are investigated to identify as optimal passivation agents for 3D MAPI perovskite solar cells (PSCs). The study highlights how altering fluorine positioning affects defect passivation, low‐dimensional phase (LDP) formation, and stability, emphasizing its role in molecular interactions and offering ...
Ali Semerci   +15 more
wiley   +1 more source

Ideal Molecular Sieving with a Dense MOF for Helium Upgrading with Highly Diffusion Selective Mixed Matrix Membranes

open access: yesAdvanced Functional Materials, EarlyView.
The separation of Helium gas from natural gas is challenging but highly important. MIL‐116(Ga), a “non‐porous” metal–organic framework is used as a molecular sieve to separate He from CH4. Druse‐like MIL‐116(Ga) particles are integrated into polysulfone mixed matrix membranes.
Ayisha Komal   +10 more
wiley   +1 more source

Carbon Nanotube 3D Integrated Circuits: From Design to Applications

open access: yesAdvanced Functional Materials, EarlyView.
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu   +3 more
wiley   +1 more source

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