Results 61 to 70 of about 2,371,758 (319)

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

Advanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek, Minhyeok Kim, Hak‐Sung Kim, Jinho Ahn, Hongyun So   +4 more
wiley   +1 more source

Research on the Thermal-Electric Coupling Behavior Under Compound AC-DC Voltage Within Saddle-Like Electric-Stress Dependence

IEEE Access, 2020
This paper proposes a nonlinear electromagnetic-thermal-velocity coupling model to study the insulation performance of converter transformer, in which the saddle-like electric-stress dependence is considered under compound alternating current-direct ...
Duan Pan, Gao Bing, Chi Cheng, Yang Fan, Luo Ping   +4 more
doaj   +1 more source

Visible and Infrared Dual‐Band Camouflage Device Using Reflective Display Technology

Advanced Materials Technologies, EarlyView.
Integrating electrochromic devices and electrophoretic display technologies has led to developing a flexible dual‐band camouflage device. The system enables adaptive modulation across visible and near‐infrared spectra through pixel‐level control, rapid switching, and bistable operation.
Ju Hyun Park, Yongjun Lee, Jiyoung Oh, Sanghoon Cheon, Byeong‐Kwon Ju, Jisu Han, Chil Seong Ah, Tae‐Youb Kim   +7 more
wiley   +1 more source

Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications

Advanced Materials Technologies, EarlyView.
Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley   +1 more source

Analyzing Bifurcation, Stability, and Wave Solutions in Nonlinear Telecommunications Models Using Transmission Lines, Hamiltonian and Jacobian Techniques [PDF]

, 2023
Ahmed Refaie Ali, Harun-Or Roshid, Shariful Islam, Asma Khatun   +3 more
openalex   +1 more source

Smart Electrochromic Devices for Wearables

Advanced Materials Technologies, EarlyView.
This article reviews the recent progress of smart electrochromic devices in the field of intelligent wearable devices. Serving as displays, dimmers, energy‐saving and energy storage devices, and temperature management components, electrochromic devices have broad prospects in flexible displays, human–computer interaction, and personalized ...
Mengjie Zhu, Bing Xu, Tongzhuang He, Abdulhakem Y. Elezzabi, Wu Zhang, William W. Yu, Jingwei Chen   +6 more
wiley   +1 more source

Fiber Bragg Gratings with Micro‐Engineered Temperature Coefficients

Advanced Optical Materials, Volume 13, Issue 8, March 13, 2025.
Fiber Bragg gratings (FBGs) are intrinsically responsive to temperature and strain simultaneously. In this research, low‐loss FBGs with micro‐engineered temperature coefficients are fabricated, utilizing refractive index liquid‐filled microchannels in the cladding.
Zipei Song, Mohan Wang, Frank P. Payne, Patrick S. Salter, Tongyu Liu, Steve J. Elston, Martin J. Booth, Stephen M. Morris, Julian A. J. Fells   +8 more
wiley   +1 more source

Available Bandwidth Metrics for Application-Layer Reliable Multicast in Global Multi-Gigabit Networks

Proceedings of the International Conference on Applied Innovations in IT, 2020
Application layer multicast shows its efficiency when it is necessary to transmit enormous amount of data to many nodes. One of the most important issues for such kind of transmission is ”what is the criteria for path construction?”.
Kirill Karpov, Maksim Iushchenko, Nikolai Mareev, Dmytro Syzov, Eduard Siemens, Viatcheslav Shuvalov   +5 more
doaj   +1 more source

The Influence of the Supporting Substrate on Single‐Particle Circular Differential Scattering of DNA Assembled Nanorod Dimers

Advanced Optical Materials, EarlyView.
For most microscopy measurements the sample is placed on a substrate, which causes symmetry breaking, especially relevant for chiral plasmonic nanostructures. DNA origami mediated X‐shaped AuNR dimers showing high structural purity in solution, exhibit significant diversity in lineshapes and signal intensities for their circular differential scattering
Amrita Chakraborty, Ojasvi Verma, Gopal Narmada Naidu, Mihir Dass, Zhenyang Jia, Christy F. Landes, Alessandro Alabastri, Peter Nordlander, Tim Liedl, Stephan Link   +9 more
wiley   +1 more source

Future of Telepresence Services in the Evolving Fog Computing Environment: A Survey on Research and Use Cases

Sensors
With the continuing development of technology, telepresence services have emerged as an essential part of modern communication systems. Concurrently, the rapid growth of fog computing presents new opportunities and challenges for integrating telepresence
Dang Van Thang, Artem Volkov, Ammar Muthanna, Andrey Koucheryavy, Abdelhamied A. Ateya, Dushantha Nalin K. Jayakody   +5 more
doaj   +1 more source