Results 171 to 180 of about 428,496 (260)

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

Advanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz, Jonas Fell, Hendrik Jost, Stefan Diebels, Hans‐Georg Herrmann   +4 more
wiley   +1 more source

Passivation Mechanism of (18-Crown-6) Potassium on Complex Defects in SnO₂ Electron Transport Layer of Solar Cells. [PDF]

Molecules
Yang S, Zhang Q, Song Q, Zhuang Y, Wang S, Dou Y, Wang J, Zhao X, Zhang L, Zhang H, Lu W, Zhang X, Wu Y, Jiang X.   +13 more
europepmc   +1 more source

Design of a Multistable Finger Prosthesis with Programmable Metamaterials

Advanced Engineering Materials, EarlyView.
This research article shows the development of a multistable programmble metamaterial for the use as a finger prosthesis. The material was designed on different hierarchical levels where the influence of geometrical parameters and combination of mechanical elements was explored.
Franziska Wenz, Jannik Krohn, Alexander Leichner, Dilip Chalissery, Heiko Andrae, Chris Eberl   +5 more
wiley   +1 more source

Significance of the direct relation between the fill factor and hole transport layer thickness in perovskite-based solar cells for green energies. [PDF]

RSC Adv
Mudassar MM, Arshad M, Salman MU, Mahmood A, Al-Masry W, Asim M, Atiq S.   +6 more
europepmc   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Argon Microwave Plasma Processed Electrodeposited FeCo Catalysts on Ti Paper as an Anode Porous Transport Layer (PTL) for Cathode-Dry Anion Exchange Membrane Water Electrolysis (AEMWE). [PDF]

ACS Omega
Wu HC, Yu SE, Cheng IC, Chen JZ.
europepmc   +1 more source

Leveraging Symbolic Artificial Intelligence and Fuzzy Logic for Materials Science: A Review of Methods, Challenges, and Applications to Scarce and Imperfect Experimental Data

Advanced Engineering Materials, EarlyView.
This article explores the transformative potential of symbolic artificial intelligence (AI) in the field of materials science, particularly in leveraging experimental data. The article presents several symbolic AI models and discusses their applications in materials science.
Ahmed Amrani, Mohamed‐Ali Belloum, Laurence Boudet, Valentin Fouillard, Edwin Friedmann, Guillaume Lacharme, Ali Mahmoud, Jean‐Philippe Poli   +7 more
wiley   +1 more source

The impact of tris(pentafluorophenyl)borane hole transport layer doping on interfacial charge extraction and recombination. [PDF]

Beilstein J Nanotechnol
Bidinakis K, Weber SAL.
europepmc   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source

Enhancing OLED Performance by Optimizing the Hole Transport Layer with a Self-Assembled Monolayer. [PDF]

Materials (Basel)
Niu Z, Wang Y, Xu Z, Liu Y, Wang W, Li S.   +5 more
europepmc   +1 more source