Results 1 to 10 of about 86 (78)

Tribo-electrochemistry induced artificial solid electrolyte interface by self-catalysis [PDF]

open access: yesNature Communications, 2021
Potassium metal is a promising alkali metal anode but formation of dendrites limits its application. Here, the authors report construction of a continuous and compact protective layer on potassium metal anode through a self-catalysis tribo ...
Chichu Qin   +8 more
doaj   +5 more sources

Mechanical, Microstructural and Tribo-Electrochemistry Characterization in Aqueous Media of Coatings Vanadium / Vanadium Nitride Used as Functional Coating for Implants

open access: yesInternational Journal of Electrochemical Science, 2016
The study presents tribo-electrochemistry properties of multilayers of Vanadium / vanadium nitride [V / VN] n (n = 1, 20, 50 and 100) deposited on surgical grade steel 316LVM through the Physical Vapor Deposition processes (PVD) using Magnetron ...
W. Aperador, J. Duque, E. Delgado
doaj   +2 more sources

Retraction Note to: “A review of lubricating mechanisms from the perspective of tribo-electrophysics and tribo-electrochemistry” [PDF]

open access: yesScience China Technological Sciences, 2019
The authors have retracted this article [1] due to redundant publication. Upon investigation by the journal’s editorial board, it was found that the majority of the content is a translation of the authors’ previous publication [2], which was not acknowledged nor cited in this current article [1]. All authors agree to this retraction.
ZeQi Jiang   +9 more
openaire   +1 more source

Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization

open access: yesLubricants
Chemical–mechanical planarization (CMP) is used to smoothen the topographies of a rough surface by combining several functions of tribology (friction, lubrication), chemistry, and electrochemistry (corrosion, wear, tribo-corrosion).
Kassapa Gamagedara, Dipankar Roy
doaj   +1 more source

Tribo-Electrochemical Considerations for Assessing Galvanic Corrosion Characteristics of Metals in Chemical Mechanical Planarization

open access: yesElectrochem
The manufacturing of integrated circuits involves multiple steps of chemical mechanical planarization (CMP) involving different materials. Mitigating CMP-induced defects is a main requirement of all CMP schemes.
Kassapa U. Gamagedara, Dipankar Roy
doaj   +1 more source

Mitigating Galvanic Corrosion of Molybdenum Diffusion Barriers in Chemical Mechanical Planarization of Copper Interconnects: A Case Study Using Imidazole in a Citrate Slurry of Neutral pH

open access: yesElectrochem
Molybdenum (Mo) is currently considered as a potential diffusion barrier material for copper (Cu) interconnects, and these interconnect structures are generally processed using the technique of chemical mechanical planarization (CMP).
Kassapa U. Gamagedara, Dipankar Roy
doaj   +1 more source

Tribo-Electrochemical Characterization of Brush-Scrubbed Post-CMP Cleaning: Results for Tartrate-Supported Removal of Residual Oxides from Copper Films

open access: yesLubricants
Wafer cleaning after chemical mechanical planarization (CMP) is a critical processing step for copper metallization in integrated circuits. Post-CMP cleaning (PCMPC) commonly combines surface (electro)chemistry with the tribology of brush scrubbing to ...
Collin M. Reff   +3 more
doaj   +1 more source

Hydrogels as Soft Ionic Conductors in Flexible and Wearable Triboelectric Nanogenerators. [PDF]

open access: yesAdv Sci (Weinh), 2022
Wu Y   +6 more
europepmc   +1 more source

Hydration layer structure modulates superlubrication by trivalent La3+ electrolytes. [PDF]

open access: yesSci Adv, 2023
Han T   +10 more
europepmc   +1 more source

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