Results 1 to 10 of about 86 (78)
Tribo-electrochemistry induced artificial solid electrolyte interface by self-catalysis [PDF]
Potassium metal is a promising alkali metal anode but formation of dendrites limits its application. Here, the authors report construction of a continuous and compact protective layer on potassium metal anode through a self-catalysis tribo ...
Chichu Qin +8 more
doaj +5 more sources
The study presents tribo-electrochemistry properties of multilayers of Vanadium / vanadium nitride [V / VN] n (n = 1, 20, 50 and 100) deposited on surgical grade steel 316LVM through the Physical Vapor Deposition processes (PVD) using Magnetron ...
W. Aperador, J. Duque, E. Delgado
doaj +2 more sources
Retraction Note to: “A review of lubricating mechanisms from the perspective of tribo-electrophysics and tribo-electrochemistry” [PDF]
The authors have retracted this article [1] due to redundant publication. Upon investigation by the journal’s editorial board, it was found that the majority of the content is a translation of the authors’ previous publication [2], which was not acknowledged nor cited in this current article [1]. All authors agree to this retraction.
ZeQi Jiang +9 more
openaire +1 more source
Chemical–mechanical planarization (CMP) is used to smoothen the topographies of a rough surface by combining several functions of tribology (friction, lubrication), chemistry, and electrochemistry (corrosion, wear, tribo-corrosion).
Kassapa Gamagedara, Dipankar Roy
doaj +1 more source
The manufacturing of integrated circuits involves multiple steps of chemical mechanical planarization (CMP) involving different materials. Mitigating CMP-induced defects is a main requirement of all CMP schemes.
Kassapa U. Gamagedara, Dipankar Roy
doaj +1 more source
Molybdenum (Mo) is currently considered as a potential diffusion barrier material for copper (Cu) interconnects, and these interconnect structures are generally processed using the technique of chemical mechanical planarization (CMP).
Kassapa U. Gamagedara, Dipankar Roy
doaj +1 more source
Wafer cleaning after chemical mechanical planarization (CMP) is a critical processing step for copper metallization in integrated circuits. Post-CMP cleaning (PCMPC) commonly combines surface (electro)chemistry with the tribology of brush scrubbing to ...
Collin M. Reff +3 more
doaj +1 more source
Effect of Ti3SiC2 and Ti3AlC2 Particles on Microstructure and Wear Resistance of Microarc Oxidation Layers on TC4 Alloy. [PDF]
Gu G, Shang J, Lin D.
europepmc +1 more source
Hydrogels as Soft Ionic Conductors in Flexible and Wearable Triboelectric Nanogenerators. [PDF]
Wu Y +6 more
europepmc +1 more source
Hydration layer structure modulates superlubrication by trivalent La3+ electrolytes. [PDF]
Han T +10 more
europepmc +1 more source

