Results 71 to 80 of about 738 (124)
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UBM data selection for effective speaker modeling
2010 7th International Symposium on Chinese Spoken Language Processing, 2010This paper presents a UBM data selection method for robust training. We know that there is no promise that more training data guarantee better results. Therefore, the way of sub-sampling and effective training become important. The proposed method uses the feature vector selection with the maximum-entropy criterion.
Chien-Lin Huang, Haizhou Li 0001
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Improved GMM-UBM/SVM For Speaker Verification
2006 IEEE International Conference on Acoustics Speed and Signal Processing Proceedings, 2006This paper combines Gaussian Mixture Model-Universal Background Model (GMM-UBM) and Support Vector Machine (SVM) through post processing the GMM-UBM scores of different dimension feature parameter with SVM in speaker verification. Because different dimension feature makes different contribution to recognition performance and SVM has good ...
Minghui Liu +3 more
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UbMed: A ubiquitous system for monitoring medication adherence
2016 IEEE 18th International Conference on e-Health Networking, Applications and Services (Healthcom), 2016One of the biggest problems with chronical patients in treatment is medication adherence. Studies indicate that taking drugs out of time influence the patient's treatment decreasing the drugs effect. To minimize this problem, we developed a ubiquitous and intelligent system able to monitor the taking of medicines and to identify whether the patient is ...
Vandermi J. Silva +3 more
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2012 14th International Conference on Electronic Materials and Packaging (EMAP), 2012
The effect of solder volume on the interfacial microstructure and mechanical properties of micro-scale line-type Ni/Sn3.0Ag0.5Cu/Ni joints was investigated. Ni wires of 300 µm in diameter were used as under-bump-metallization (UBM) to be connected by Sn3.0Ag0.5Cu solder balls. The solder joints were assembled by modeling the thermal cycle of the reflow
Jing-Bo Zeng +3 more
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The effect of solder volume on the interfacial microstructure and mechanical properties of micro-scale line-type Ni/Sn3.0Ag0.5Cu/Ni joints was investigated. Ni wires of 300 µm in diameter were used as under-bump-metallization (UBM) to be connected by Sn3.0Ag0.5Cu solder balls. The solder joints were assembled by modeling the thermal cycle of the reflow
Jing-Bo Zeng +3 more
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An UBM-Based Reference Space for Speaker Recognition
18th International Conference on Pattern Recognition (ICPR'06), 2006The universal background model represents the speaker independent distribution of features, so it can be used to construct a reference space for speaker recognition. In the anchor models, one speaker utterance can be located at one point in the anchor space.
Zhenchun Lei +2 more
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Audio classification based on SVM-UBM
2008 9th International Conference on Signal Processing, 2008Audio classification is an important issue in current audio processing and content analysis researches. In this paper we present a high-accuracy audio classification algorithm based on SVM-UBM using MFCCs as classification features. Firstly MFCCs are extracted in frame level, then a Universal Background Gaussian Mixture Model (UBM) is employed to ...
null Ruijie Zhang +2 more
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Wafer-Level Packaging Symposium, 2005
ABSTRACT Under Bump Metallization (UBM) using Electroless Nickel / Immersion Gold (ENIG) is a low cost option for deposition of UBM layers. Unlike dry methods involving vacuum techniques, this technology uses wet processes and can offer economic and throughput advantages.
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ABSTRACT Under Bump Metallization (UBM) using Electroless Nickel / Immersion Gold (ENIG) is a low cost option for deposition of UBM layers. Unlike dry methods involving vacuum techniques, this technology uses wet processes and can offer economic and throughput advantages.
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An Abnormal Speech Detection Algorithm Based on GMM-UBM
Journal of Multimedia, 2014To overcome the defects of common used algorithms based on model for abnormal speech recognition, which existed insufficient training data and difficult to fit each type of abnormal characters, an abnormal speech detection method based on GMM-UBM was proposed in this paper.
Jun He +4 more
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Thermal Sensitivity of UBM Adhesion in WLCSP
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2006Recent developments in WLCSP proved Polyimide to be a good alternative to Benzocyclobutene as a passivation material and dielectric interlayer. An interface adhesion failure between PI and Ni-V under bump metallurgy was recently reported after significant exposure to high temperature.
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