Results 141 to 150 of about 144,621 (340)
This research investigates the heat treatment parameters of 6061-aluminum alloy to enhance its mechanical properties. The Taguchi design-of-experiments (DOE) method was employed to systematically examine the effects of solutionizing temperature ...
Isidro Guzmán-Flores +7 more
doaj +1 more source
Study of high performance alloy electroforming [PDF]
Nickel-manganese electroformed specimens and nickel-cobalt-manganese samples were heat treated at 343 C (650 F) for comparison of room temperature ductility with that observed for alloys heat treated at 315.6C (600 F).
Malone, G. A.
core +1 more source
Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley +1 more source
Ultra‐Thin Soft Pneumatic Actuation for Minimally Invasive Neural Interfacing
Parylene C is a common polymer in bioelectronics, favored for its biological and chemical inertness. However, this makes bonding layers of Parylene C together very challenging. Here it is a laser to selectively weld layers of Parylene C to create high‐pressure fluidic actuation devices.
Lawrence Coles +4 more
wiley +1 more source
Advances in Safe, Flexible, and Stretchable Batteries for Wearable Applications
Unlike previous reviews centered on component‐based deformability, this work highlights safety‐driven design strategies for flexible and stretchable batteries. By integrating material‐level engineering, geometry‐controlled structures, biocompatibility, and self‐protection mechanisms, it establishes a unified framework that connects mechanical ...
Hyewon Kang +4 more
wiley +1 more source
Adhesive Double‐Network Granular Organogel E‐Skin
We introduce a double‐network granular organogel adhesive for electronic skin, overcoming adhesion and strength trade‐offs. It provides reversible, robust bonding and ionic conductivity, enabling wearable and soft robotic e‐skin. Thanks to the e‐skin adhesive, a soft robotic trunk can recognize touch, temperature, humidity, and acidity.
Antonia Georgopoulou +4 more
wiley +1 more source
Vat Photopolymerized HEMA/HEA Hydrogels for Solvent‐Responsive Transparency and Optical Encryption
Vat‐photopolymerized HEMA/HEA hydrogels exhibit reversible transparency‐opacity switching via hydration‐induced microphase separation and solvent exchange. The printed materials enable hydration sensing, optical encryption, and information storage, while maintaining high ductility and reversible rheology.
Murad Ali +4 more
wiley +1 more source
Multi‐Material Additive Manufacturing of Soft Robotic Systems: A Comprehensive Review
This review explores the transformative role of multi‐material additive manufacturing (MMAM) in the development of soft robotic systems. It presents current techniques, materials, and design strategies that enable functionally graded and adaptive structures.
Ritik Raj +2 more
wiley +1 more source
Effects of Conventional Welding and Laser Welding on the Tensile Strength, Ultimate Tensile Strength and Surface Characteristics of Two Cobalt–Chromium Alloys: A Comparative Study [PDF]
Madhan Kumar Seenivasan +3 more
openalex +1 more source

