Results 181 to 190 of about 137,347 (342)

In Situ Formation of Mechanically Interlocked Heterointerfaces with Ultrahigh Bonding Strength for Mg‐Based Multilayered Sheets

open access: yesAdvanced Science, EarlyView.
Crystal‐orientation controlled hot‐rolling strategy creates Mg‐Ta immiscible composites featuring mechanically interlocked in situ formed interfaces (80.5 MPa bond strength) and excellent tensile properties (340–395 MPa UTS). Systematic multiscale investigations reveal a serration‐size‐dependent bonding mechanism and a three‐stage interfacial evolution
Zhilei Yu   +8 more
wiley   +1 more source

Evaluation of pH, ultimate tensile strength, and micro-shear bond strength of two self-adhesive resin cements [PDF]

open access: diamond, 2014
Luciana Artioli Costa   +4 more
openalex   +1 more source

Engineering of Multi‐Dynamic Bonds Toward Room‐Temperature Self‐Healing Epoxy/MXene Adaptable Network with Record‐High Toughness

open access: yesAdvanced Science, EarlyView.
Inspired by mussel nacre and byssus, a multi‐type dynamic chemically bonded epoxy/MXene adaptable network is fabricated through a hierarchical assembly strategy, establishing the toughest (210.75 MJ m−3) room‐temperature self‐healing (90.04% recovery within 2 h at 25 °C) epoxy resin to date, challenging the limitations of conventional thermosetting ...
Xiaobo Zhu   +4 more
wiley   +1 more source

Ultrahigh Strength and Exceptional Work Hardening in a Hierarchical‐Structured Alloy via Hetero‐Interface‐Mediated Twinning

open access: yesAdvanced Science, EarlyView.
This study presents a novel strategy for achieving exceptional work hardening in ultrahigh‐strength alloys by designing hierarchically heterogeneous dual‐phase (HHDP) structures, where hetero‐deformation‐induced strain gradients activate deformation twinning.
Yitong Yang   +9 more
wiley   +1 more source

Novel Porous Gold Microspheres Anisotropic Conductive Film (PGMS‐ACF) with High Compression Ratio for Flip Chip Packaging

open access: yesAdvanced Electronic Materials, EarlyView.
This research presents a novel method for preparing porous gold microspheres with controllable particle size. The method can overcome the long‐term challenge of manufacturing ultrafine (1–10 µm) porous gold conductive microspheres. Compared to commercial polymer composite conductive microspheres anisotropic conductive film (ACF), porous gold ...
Li Zhang   +6 more
wiley   +1 more source

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