Results 201 to 210 of about 144,621 (340)

Interface Engineering Suppresses Self‐Annealing in Electroplated Nanograined Copper for Low‐Temperature Copper‐to‐Copper Bonding

open access: yesAdvanced Science, EarlyView.
A (111)‐oriented nanotwinned copper substrate stabilizes the deposited nanograined copper and prevents self‐annealing by restricting grain boundary motion at the interface and promoting the formation of stacking faults within the nanograined copper. Its preserved nanostructure maintains bonding capability even after 30 days of storage, resulting in ...
Gangqiang Peng   +17 more
wiley   +1 more source

Orbital Hybridization‐Mediated Decoupling of Electrocatalytic Functions for Paired CO2 Electrosynthesis

open access: yesAdvanced Science, EarlyView.
This study constructs a dual‐scale Ag‐based catalyst on CeO2 nanorods via a facet‐guided strategy. This catalyst can induce a cascaded orbital hybridization effect, which synergistically optimizes oxygen vacancy stability, CO desorption kinetics, and charge transfer efficiency.
Youjia Wang   +6 more
wiley   +1 more source

Data‐Driven Design and Fabrication of Heat‐Resistant, Ultrastrong, Lightweight Aluminum‐Based Entropy Alloy by Additive Manufacturing

open access: yesAdvanced Science, EarlyView.
A data‐driven strategy integrating quantum machine learning (QML) and high‐throughput computing overcomes hot‐cracking limitation to design a novel lightweight aluminum‐based entropy alloy for additive manufacturing. The fabrication transforms brittle intermetallics into deformable hierarchical nanostructures, yielding ultrastrong strength (>1 GPa) and
Enmao Wang   +6 more
wiley   +1 more source

XHEMTs on Ultrawide Bandgap Single‐Crystal AlN Substrates

open access: yesAdvanced Electronic Materials, EarlyView.
AlN/GaN/AlN XHEMTs [single‐crystal (“X‐tal”) high‐electron‐mobility transistors] are built on bulk AlN substrates with a 20 nm pseudomorphic GaN channel. This coherent epitaxial double heterostructure promises low‐defect, thermally efficient nitride electronics for next‐generation RF technology.
Eungkyun Kim   +6 more
wiley   +1 more source

In Situ estimate of ultimate tensile strength for part optimization in extrusion-based additive manufacturing

open access: diamond, 2020
Sadegh Nouri Gooshki   +5 more
openalex   +1 more source

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