Results 131 to 140 of about 961,052 (305)

Ultra-Low-Temperature CO Oxidation Activity of Octahedral Site Cobalt Species in Co3O4 Based Catalysts: Unravelling the Origin of the Unique Catalytic Property

open access: yes, 2019
Co3O4 with spinel structure shows CO oxidation activity at very low temperature under dry conditions. This study aims at finding the origin of the unique catalytic activity of Co species in Co3O4 based oxides.
Mingyue Lin (5644181)   +16 more
core   +1 more source

Integration of Low‐Voltage Nanoscale MoS2 Memristors on CMOS Microchips

open access: yesAdvanced Functional Materials, EarlyView.
This article presents the first monolithic integration of nanoscale MoS2‐based memristors into the back‐end‐of‐line of foundry‐fabricated CMOS microchips in a one‐transistor‐one‐resistor (1T1R) architecture. The MoS2‐based 1T1R cells exhibit forming‐free, nonvolatile resistive switching with ultra‐low operating voltages, low cycle‐to‐cycle variability ...
Jimin Lee   +16 more
wiley   +1 more source

Strain‐Programmable Luminescent Adhesive Patch With Tartrazine‐Mediated Optical Skin Clearing for Photochemical Tissue Bonding

open access: yesAdvanced Functional Materials, EarlyView.
We propose a suture‐complementary approach that integrates optical skin clearing with a strain‐programmable luminescent adhesive patch. Hyaluronic acid promotes transdermal delivery of tartrazine to improve optical clearing and stabilizes its interaction with a photosensitizer. Optical clearing increases the penetration depth of visible light into skin,
Seong‐Jong Kim   +6 more
wiley   +1 more source

Camera design in ultra-low temperature vessel

open access: yes, 2012
According to special application, surveillance camera working in the ultra-low temperature and high pressure vessel is designed. By request of optics and electronics system on temperature, research focus on the design from selection of the structure ...
Cao, Jian-Zhong   +8 more
core  

Reinforced Concrete Beam Stress Performance at Ultra-low Temperature

open access: yes, 2011
For the study of reinforced concrete beam stress performance under ultra-low temperature, based on the material constitutive and mechanism at ultra-low temperature, Using DIANA software environment, the numerical simulations is implemented, component ...
Lv, Chao, Liu, Shuang
core   +1 more source

Oxygen‐Tunnel Indium Tin Oxide Vertical Channel Transistors with Enhanced Current Density and Reliability for Monolithic 3D Compute‐In‐Memory Systems

open access: yesAdvanced Functional Materials, EarlyView.
Oxygen‐tunnel (OT) indium tin oxide (ITO) vertical channel transistors (VCTs) enable reliable, high‐density gain‐cell memory for monolithic 3D integration. A sandwiched SiN/SiO2/SiN OT stack selectively regulates oxygen transport, suppressing parasitic electrode oxidation while stabilizing channel oxygen vacancies, thereby suppressing carrier injection
Hyeonho Gu   +17 more
wiley   +1 more source

A novel ultra low power temperature sensor for UHF RFID tag chip

open access: yes, 2007
A novel ultra low power temperature sensor for UHF RFID tag chip is presented. The sensor consists of a constant pulse generator, a temperature related oscillator, a counter and a bias. Conversion of temperature to digital output is fulfilled by counting
Wu, NJ   +2 more
core  

Labelled dataset for Ultra-Low Temperature Freezer to aid dynamic modelling & fault detection and diagnostics. [PDF]

open access: yesSci Data, 2023
Huang T   +5 more
europepmc   +1 more source

Achieving High ON State Current through Ferroelectric Polarization‐Dependent Interfacial Resistance Switching in Undoped Orthorhombic HfO2 Films

open access: yesAdvanced Functional Materials, EarlyView.
Ferroelectric tunnel junction devices based on epitaxial undoped ferroelectric HfO2 films demonstrate stable switching endurance of over 106 switching cycles, low write voltages of ±3 V, 16 measured resistance states, and neuromorphic capability.
Markus Hellenbrand   +13 more
wiley   +1 more source

The Effect of Through-Silicon-Via Thermal Stress on Metal-Oxide-Semiconductor Field-Effect Transistor Properties Under Cooling to Ultra-Low Temperatures

open access: yesMicromachines
The thermal through-silicon-via (TTSV) has a serious thermal stress problem due to the mismatch of the coefficient of thermal expansion between the Si substrate and filler metal. At present, the thermal stress characteristics and strain mechanism of TTSV
Wenting Xie   +5 more
doaj   +1 more source

Home - About - Disclaimer - Privacy